I-4oz Multilayer FR4 PCB Ibhodi kwi-ENIG esetyenziswa kuShishino lwaMandla kunye ne-IPC yoKlasi 3
Ulwazi lokwenziwa kwemveliso
| Umzekelo No. | PCB-A9 |
| Iphakheji yezothutho | Ukupakishwa kweVacuum |
| Isiqinisekiso | UL, ISO9001&ISO14001,RoHS |
| Isicelo | Ii-elektroniki zabathengi |
| Ubuncinane besithuba/umgca | 0.075mm/3mil |
| Isakhono seMveliso | 50,000 sqm / ngenyanga |
| Ikhowudi ye-HS | 853400900 |
| Imvelaphi | Yenziwe etshayina |
Ingcaciso yeMveliso
FR4 PCB Intshayelelo
Ingcaciso
I-FR ithetha "i-flame-retardant," i-FR-4 (okanye i-FR4) luphawu lwebakala le-NEMA lwe-glass-reinforced epoxy laminate material, imathiriyeli edityanisiweyo eyenziwe ngelaphu elilukiweyo le-fiberglass kunye ne-epoxy resin binder eyenza ibe yi-substrate efanelekileyo kwizinto zombane. kwibhodi yesiphaluka eprintiweyo.
IiPros and Cons of FR4 PCB
Izinto ze-FR-4 zithandwa kakhulu ngenxa yeempawu zayo ezininzi ezinokuthi zizuze iibhodi zesekethe eziprintiweyo.Ukongeza ekufikeleleni kwaye kulula ukusebenza nayo, sisigqubuthelo sombane esinamandla aphezulu kakhulu e-dielectric.Ngaphezu koko, yomelele, ixhathise ukufuma, ixhathisa ubushushu kwaye ikhaphukhaphu.
I-FR-4 yimathiriyeli efanelekileyo ngokubanzi, ethandwa kakhulu ngenxa yeendleko zayo eziphantsi kunye nokuzinza komatshini kunye nombane.Ngelixa le mathiriyeli ineenzuzo ezibanzi kwaye ifumaneka kwiindidi ezahlukeneyo zobunzima kunye nobukhulu, ayilolona khetho lungcono kwisicelo ngasinye, ngakumbi usetyenziso olusebenza ngamaza amaninzi njengeRF kunye noyilo lwemicrowave.
Ulwakhiwo lwePCB enamaleko amaninzi
Ii-PCB ze-Multilayer zandisa ngakumbi ukuntsonkotha kunye nokuxinana koyilo lwe-PCB ngokongeza umaleko ongezelelweyo ngaphaya kwamaleya aphezulu nasezantsi abonwa kwiibhodi ezimacala mabini.Ii-PCB ezininzi zakhiwe ngokulayita iileya ezahlukeneyo.Iibhodi zesekethe zangaphakathi, eziqhelekileyo ezinamacala amabini, zixutywe kunye, kunye neengqimba ezikhuselayo phakathi naphakathi kwe-copper-foil kwi-outer-layers.Imingxuma egrunjiweyo ngebhodi (nge-vias) iya kwenza unxibelelwano kunye neengqimba ezahlukeneyo zebhodi.
Ubuchwephesha kunye nokubanakho
| Into | Isakhono seMveliso |
| Umaleko ubala | I-1-20 imigangatho |
| Izinto eziphathekayo | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, njl. |
| Ubukhulu bebhodi | 0.10mm-8.00mm |
| Ubungakanani obukhulu | 600mmX1200mm |
| Unyamezelo lolwandlalo lweBhodi | +0.10mm |
| Ukunyamezela ukutyeba(t≥0.8mm) | ±8% |
| Ukunyamezela ukutyeba(t<0.8mm) | ±10% |
| I-Insulation Layer Ukutyeba | 0.075mm--5.00mm |
| Ubuncinci bomgca | 0.075mm |
| Ubuncinci besithuba | 0.075mm |
| Out Layer Copper Ukutyeba | 18um--350um |
| Ngaphakathi Layer Copper Ukutyeba | 17um--175um |
| Umngxuma woKwemba (Oomatshini) | 0.15mm--6.35mm |
| Gqiba umngxuma (Mechanical) | 0.10mm-6.30mm |
| Ukunyamezelwa kweDiameter(Mechanical) | 0.05mm |
| Ubhaliso(oomatshini) | 0.075mm |
| Umgangatho wento | 16:1 |
| Uhlobo lweMaski yeSolder | LPI |
| SMT Mini.Solder Mask Ububanzi | 0.075mm |
| Mini.I-Solder Mask Clearance | 0.05mm |
| I-Plag Hole Diameter | 0.25mm--0.60mm |
| Ulawulo lwe-Impedans Unyamezelo | ±10% |
| Ukugqitywa komphezulu / unyango | HASL, ENIG, Chem, Tin, Flash Gold, OSP, Gold Finger |
Q / T Ixesha lokukhokela
| Udidi | Ixesha lokukhokela elikhawulezayo | Ixesha eliqhelekileyo lokukhokela |
| Amacala amabini | Iiyure ezingama-24 | 120hrs |
| 4 Iileya | Iiyure ezingama-48 | 172hrs |
| 6 Iileya | 72hrs | 192hrs |
| 8 Iileya | Iiyure ezingama-96 | 212hrs |
| Iileya ezili-10 | 120hrs | iiyure ezingama-268 |
| 12 Iileya | 120hrs | 280hrs |
| 14 Iileya | Iiyure ezingama-144 | 292hrs |
| 16-20 Iileya | Kuxhomekeke kwiimfuno ezithile | |
| Ngaphezulu kwe20 Layers | Kuxhomekeke kwiimfuno ezithile | |
Intshukumo ye-ABIS yokulawula i-FR4 PCBS
Ukulungiswa komngxuma
Ukususa i-debris ngononophelo kunye nokulungelelanisa iiparamitha zoomatshini bokuqhuba: phambi kokucoca ngobhedu, i-ABIS ihlawula ingqalelo ephezulu kuyo yonke imingxuma kwi-FR4 PCB ephathwayo ukususa inkunkuma, izitenxo zomphezulu, kunye ne-epoxy smear, imingxuma ecocekileyo iqinisekisa ukuba iplating ibambelela ngempumelelo kwiindonga zomngxunya. .kwakhona, ekuqaleni kwenkqubo, iiparamitha zoomatshini bokuqhuba zihlengahlengiswa ngokuchanekileyo.
Ukulungiswa komphezulu
Ukuhlawula ngononophelo: abasebenzi bethu bezobuchwepheshe abanamava baya kuqaphela kwangaphambili ukuba ekuphela kwendlela yokuphepha umphumo ombi kukulindela imfuno yokuphathwa okukhethekileyo kunye nokuthatha amanyathelo afanelekileyo ukuqinisekisa ukuba inkqubo yenziwa ngononophelo nangokuchanekileyo.
Amazinga oKwandiswa kweThermal
Ukuqhelana nokujongana nezinto ezahlukeneyo, i-ABIS iya kukwazi ukuhlalutya ukudibanisa ukuze kuqinisekiswe ukuba kufanelekile.emva koko ukugcina ukuthembeka kwexesha elide le-CTE (i-coefficient yokwandiswa kwe-thermal), kunye ne-CTE ephantsi, i-CTE engaphantsi, into engenakwenzeka ukuba ifakwe kwimingxuma yokungaphumeleli ukuguquguquka okuphindaphindiweyo kobhedu okwenza udibaniso lwangaphakathi lwangaphakathi.
Ukukala
Ulawulo lwe-ABIS i-circuitry ihlaziywa ngeepesenti ezaziwayo ngokulindela le lahleko ukwenzela ukuba iileyile ziya kubuyela kwimilinganiselo yazo eyilelwe emva kokuba umjikelo we-lamination ugqityiwe.kwakhona, usebenzisa izindululo zokukalwa kwesiseko somenzi welaminate ngokudityaniswa nedatha yolawulo lwenkqubo yobalo lwangaphakathi, ukucofa imiba yesikali eya kuthi ihambelane ngokuhamba kwexesha ngaphakathi kuloo ndawo yokuvelisa.
Umatshini
Xa kufika ixesha lokwakha i-PCB yakho, i-ABIS qiniseka ukuba ukhetha inezixhobo ezifanelekileyo kunye namava okuyivelisa ngokuchanekileyo kwi-try yokuqala.
PCB Product&Equipment Show
I-PCB eqinile, i-Flexible PCB, i-Rigid-Flex PCB, i-HDI PCB, i-PCB Assembly
Umnqophiso woMgangatho we-ABIS
ULUHLU lwezixhobo eziphezulu
| Uvavanyo lwe-AOI | Iitshekhi zokujonga i-solder pasteChecks zamacandelo ukuya kuthi ga ku-0201 Ijonga izinto ezingekhoyo, i-offset, iindawo ezingachanekanga, i-polarity |
| Ukuhlolwa kweX-Ray | I-X-Ray ibonelela ngohlolo olukwisisombululo esiphezulu se:BGAs/Micro BGAs/iiphakheji zesikali seChip / iibhodi ezingenanto |
| Uvavanyo lweSekethe | Uvavanyo lwe-In-Circuit Testing ludla ngokusetyenziswa ngokubambisana ne-AOI ukunciphisa iziphene ezibangwa ziingxaki zecandelo. |
| Uvavanyo lwamandla-phezulu | Advanced Function TestFlash Device Programming Uvavanyo olusebenzayo |
Uhlolo olungenayo lwe-IOC
SPI solder intlama ukuhlolwa
Ukuhlolwa kwe-AOI kwi-Intanethi
Ukuhlolwa kwenqaku lokuqala le-SMT
Uvavanyo lwangaphandle
Ukuhlolwa kwe-X-RAY-welding
BGA isixhobo rework
Ukuhlolwa kwe-QA
I-Anti-static warehousing kunye nokuthunyelwa
Pulandela i-0% yesikhalazo kumgangatho
Onke amasebe asebenza ngokwe-ISO kunye nesebe elinxulumeneyo kufuneka libonelele ngengxelo ye-8D ukuba nayiphi na ibhodi iye yalahlwa ngesiphene.
Zonke iibhodi eziphumayo kufuneka zivavanywe nge-100% ye-elektroniki, i-impedance ivavanywe kunye ne-soldering.
Ukuhlolwa okubonakalayo, senza i-microsection yokuhlola ngaphambi kokuthunyelwa.
Qeqesha ingqondo yabasebenzi kunye nenkcubeko yeshishini lethu, benze bonwabe ngomsebenzi wabo kunye nenkampani yethu, kuluncedo kubo ukuvelisa iimveliso ezisemgangathweni.
Umgangatho ophezulu wezinto eziluhlaza (i-Shengyi FR4, i-ITEQ, i-Taiyo Solder Mask Ink njl.)
I-AOI inokuhlola isethi yonke, iibhodi ziyahlolwa emva kwenkqubo nganye
Isatifikethi
FAQ
Ukuqinisekisa isicatshulwa esichanekileyo, qiniseka ukuba ubandakanya ulwazi olulandelayo lweprojekthi yakho:
Gqibezela iifayile zeGERBER kuquka noluhlu lweBOM
l Ubungakanani
l Ixesha lokuvula
l IiMfuno zephaneli
l Iimfuno zeMathiriyeli
l Gqibezela iimfuno
l Isicatshulwa sakho esiqhelekileyo siya kuhanjiswa kwiiyure nje ze-2-24, kuxhomekeke kubunzima boyilo.
UmThengi ngamnye uya kuba nentengiso yokunxibelelana nawe.Iiyure zethu zokusebenza: AM 9:00-PM 19:00 (Ixesha laseBeijing) ukusuka ngoMvulo ukuya ngoLwesihlanu.Siza kuphendula i-imeyile yakho ngokukhawuleza ngexesha lethu lokusebenza.Kwaye ungaqhagamshelana neentengiso zethu ngeselfowuni ukuba zingxamisekile.
ISO9001, ISO14001,UL USA&USA Canada,IFA16949, SGS, RoHS ingxelo.
IiNkqubo zethu zokuqinisekisa uMgangatho zingezantsi:
a), uHlolo oluBonakalayo
b), iFlying probe, isixhobo sokulungisa
c), Ulawulo lokuphazamiseka
d), ukubonwa kobuchule bomthengisi
e), imakroskopu yedijithali ye-metallo yegrafikhi
f), i-AOI (Uhlolo oluSebenzayo oluSebenzayo)
Ewe, siyavuya ukubonelela ngeesampulu zemodyuli ukuvavanya kwaye ujonge umgangatho, iodolo yesampulu exutyiweyo iyafumaneka.Nceda uqaphele ukuba umthengi kufuneka ahlawule iindleko zokuthumela.
Ngexesha lokuhanjiswa kwexesha lingaphezulu kwe-95%
a), iiyure ezingama-24 zijika ngokukhawuleza kwicala eliphindwe kabini leprototype PCB
b), iiyure ezingama-48 ze-4-8 umaleko weprototype PCB
c), iyure e-1 yekoteyishini
d), iiyure ezi-2 zombuzo wenjineli/ingxelo yesikhalazo
e), iiyure ze-7-24 zenkxaso yobugcisa / inkonzo ye-odolo / imisebenzi yokuvelisa
I-ABIS ayisoze ikhethe iiodolo.Zombini iiodolo ezincinci kunye neMisa yamkelekile kwaye Thina i-ABIS siya kuba nenkathalo kwaye sinoxanduva, kwaye sikhonze abathengi ngomgangatho kunye nobungakanani.
I-ABlS yenza i-100% yokuhlola okubonwayo kunye ne-AOl kunye nokwenza uvavanyo lombane, uvavanyo lombane ophezulu, uvavanyo lokulawula i-impedance, i-micro-sectioning, uvavanyo lwe-thermal shock, uvavanyo lwe-solder, uvavanyo lokuthembeka, uvavanyo lwe-insulating resistance, uvavanyo lokucoceka kwe-ionic kunye novavanyo olusebenzayo lwe-PCBA.
a), iyure e-1 yocaphulo
b), iiyure ezi-2 zengxelo yesikhalazo
c), 7*24 iyure inkxaso yobugcisa
d), 7*24 inkonzo ye-odolo
e), 7 * 24 ukuhanjiswa kweyure
f), 7*24 imveliso run
| Umthamo wemveliso yeemveliso ezithengiswayo ezishushu | |
| Icala eliphindwe kabini/I-Multilayer PCB Workshop | I-Aluminiyam PCB Workshop |
| UbuGcisa boBugcisa | UbuGcisa boBugcisa |
| Imathiriyeli ekrwada: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Izinto ezibonakalayo: Isiseko seAluminiyam, isiseko sobhedu |
| Umaleko: 1 umaleko ukuya kwi-20 Layers | Umaleko: 1 umaleko kunye neeLayers ezi-2 |
| Min.line ububanzi/isithuba: 3mil/3mil(0.075mm/0.075mm) | Min.line ububanzi/isithuba: 4mil/4mil(0.1mm/0.1mm) |
| Ubungakanani bomngxuma omncinci: 0.1mm(umngxuma wokuvala) | Min.Ubungakanani bomngxuma: 12mil(0.3mm) |
| Max.Ubungakanani bebhodi: 1200mm * 600mm | Ubukhulu bebhodi: 1200mm* 560mm(47in* 22in) |
| Ubukhulu bebhodi egqityiweyo: 0.2mm- 6.0mm | Ugqitywe ubukhulu bebhodi: 0.3 ~ 5mm |
| Ubukhulu befoyile yobhedu: 18um~280um(0.5oz~8oz) | Ubukhulu befoyile yobhedu: 35um~210um(1oz~6oz) |
| NPTH Ukunyamezela umngxuma: +/-0.075mm, PTH ukunyamezela umngxuma: +/-0.05mm | Ukunyamezela indawo yomngxuma: +/-0.05mm |
| Ukunyamezelana kolwandlalo: +/-0.13mm | Ukunyamezela ulwandlalo lwendlela: +/ 0.15mm;ukunyamezela ulwandlalo lokubetha:+/ 0.1mm |
| Umphezulu ugqityiwe: I-HASL engenalo isikhokelo, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP, ukufakwa kwegolide, umnwe wegolide, iCarbon INK. | Umphezulu ugqityiwe: Isikhokelo sasimahla seHASL, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP njl |
| Ukunyamezela ukunyamezela: +/-10% | Hlala ukunyamezela ubunzima: +/-0.1mm |
| Ikhono lokuvelisa: 50,000 sqm / ngenyanga | MC PCB Ukuvelisa amandla: 10,000 sqm / ngenyanga |
