Customized Hard Gold PCB Board FR4 Rigid Multilayer PCB Manufacturing

Inkcazelo emfutshane:


  • INOMBOLO yoMfanekiso.PCB-A14
  • Umaleko: 4L
  • Ubungakanani:40*40mm
  • Izinto ezisisiseko:FR4
  • Ukutyeba kwebhodi:1.6mm
  • Ibala elingaphezulu:ENIG
  • Ukutyeba kobhedu:2.0oz
  • Umbala wemaski yeSolder:Luhlaza
  • Ubuchwephesha obukhethekileyo:VIP
  • Iinkcukacha zeMveliso

    Iithegi zeMveliso

    Ulwazi olusisiseko

    Umzekelo No. PCB-A14
    Iphakheji yezothutho Ukupakishwa kweVacuum
    Isiqinisekiso UL, ISO9001&ISO14001,RoHS
    Isicelo Ii-elektroniki zabathengi
    Ubuncinane besithuba/umgca 0.075mm/3mil
    Isakhono seMveliso 50,000 sqm / ngenyanga
    Ikhowudi ye-HS 853400900
    Imvelaphi Yenziwe etshayina

    Ingcaciso yeMveliso

    FR4 PCB Intshayelelo

    I-FR ithetha "i-flame-retardant," i-FR-4 (okanye i-FR4) luphawu lwebakala le-NEMA lwe-glass-reinforced epoxy laminate material, imathiriyeli edityanisiweyo eyenziwe ngelaphu elilukiweyo le-fiberglass kunye ne-epoxy resin binder eyenza ibe yi-substrate efanelekileyo kwizinto zombane. kwibhodi yesiphaluka eprintiweyo.

    FR4 PCB Intshayelelo

    IiPros and Cons of FR4 PCB

    Izinto ze-FR-4 zithandwa kakhulu ngenxa yeempawu zayo ezininzi ezinokuthi zizuze iibhodi zesekethe eziprintiweyo.Ukongeza ekufikeleleni kwaye kulula ukusebenza nayo, sisigqubuthelo sombane esinamandla aphezulu kakhulu e-dielectric.Ngaphezu koko, yomelele, ixhathise ukufuma, ixhathisa ubushushu kwaye ikhaphukhaphu.

    I-FR-4 yimathiriyeli efanelekileyo ngokubanzi, ethandwa kakhulu ngenxa yeendleko zayo eziphantsi kunye nokuzinza komatshini kunye nombane.Ngelixa le mathiriyeli ineenzuzo ezibanzi kwaye ifumaneka kwiindidi ezahlukeneyo zobunzima kunye nobukhulu, ayilolona khetho lungcono kwisicelo ngasinye, ngakumbi usetyenziso olusebenza ngamaza amaninzi njengeRF kunye noyilo lwemicrowave.

    Ulwakhiwo lweePCB ezimacala amabini

    IiPCB ezimacala amabini mhlawumbi lolona hlobo luqhelekileyo lweePCBs.Ngokungafaniyo neePCB zomaleko omnye, ezinomaleko okuqhubayo kwelinye icala lebhodi, i-PCB eMacaleni aMbini iza nocweyo lobhedu oluqhubayo kumacala omabini ebhodi.Iisekethe ze-elektroniki kwelinye icala lebhodi zinokudibaniswa kwelinye icala lebhodi ngoncedo lwemingxuma (nge-vias) eqhutywe ngebhodi.Ukukwazi ukuwela iindlela ukusuka phezulu ukuya ezantsi kwandisa kakhulu ukuguquguquka komyili wesekethe kwiisekethe zokuyila kunye nokuziboleka ngokwanda kakhulu koxinzelelo lwesekethe.

    Ulwakhiwo lwePCB enamaleko amaninzi

    Ii-PCB ze-Multilayer zandisa ngakumbi ukuntsonkotha kunye nokuxinana koyilo lwe-PCB ngokongeza umaleko ongezelelweyo ngaphaya kwamaleya aphezulu nasezantsi abonwa kwiibhodi ezimacala mabini.Ii-PCB ezininzi zakhiwe ngokulayita iileya ezahlukeneyo.Iibhodi zesekethe zangaphakathi, eziqhelekileyo ezinamacala amabini, zixutywe kunye, kunye neengqimba ezikhuselayo phakathi naphakathi kwe-copper-foil kwi-outer-layers.Imingxuma egrunjiweyo ngebhodi (nge-vias) iya kwenza unxibelelwano kunye neengqimba ezahlukeneyo zebhodi.

    Zivela phi izinto ze-resin kwi-ABIS?

    Uninzi lwabo luvela kwi-Shengyi Technology Co., Ltd. (SYTECH), oye waba ngumvelisi wesibini we-CCL omkhulu wehlabathi ngokwexabiso lokuthengisa, ukusuka kwi-2013 ukuya kwi-2017. Saseka ubudlelwane bexesha elide lentsebenziswano ukususela ngo-2006. I-FR4 resin material (Imodeli ye-S1000-2, i-S1141, i-S1165, i-S1600) isetyenziselwa ukwenza iibhodi zeesekethe eziprintiweyo ezizimeleyo kunye namacala amabini kunye neebhodi ezininzi.Nazi iinkcukacha eziza kubhekisa kwireferensi yakho.

    Kwi-FR-4: I-Sheng Yi, iBhodi yoKumkani, i-Nan Ya, i-Polycard, i-ITEQ, i-ISOLA

    Kwi-CEM-1 kunye ne-CEM 3: iSheng Yi, iBhodi yoKumkani

    Ngamaxesha amaninzi: Sheng Yi

    Kunyango lweUV: Tamura, Chang Xing ( * Umbala okhoyo: oluhlaza) ISolder yecala elinye

    Ifoto yolwelo: Tao Yang, Nqana (iFilimu emanzi)

    I-Chuan Yu ( * Imibala ekhoyo : Mhlophe, iThengisi enokucingeleka etyheli, emfusa, ebomvu, eBlue, eluhlaza, emnyama)

    Ubuchwephesha kunye nokubanakho

    Amava e-ABIS ekwenzeni izinto ezikhethekileyo zePCB eqinileyo, njenge: CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, njl. Apha ngezantsi kushwankathelwe ngeFYI.

    Into Isakhono seMveliso
    Umaleko ubala I-1-20 imigangatho
    Izinto eziphathekayo FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, njl.
    Ubukhulu bebhodi 0.10mm-8.00mm
    Ubungakanani obukhulu 600mmX1200mm
    Unyamezelo lolwandlalo lweBhodi +0.10mm
    Ukunyamezela ukutyeba(t≥0.8mm) ±8%
    Ukunyamezela ukutyeba(t<0.8mm) ±10%
    I-Insulation Layer Ukutyeba 0.075mm--5.00mm
    Ubuncinci bomgca 0.075mm
    Ubuncinci besithuba 0.075mm
    Out Layer Copper Ukutyeba 18um--350um
    Ngaphakathi Layer Copper Ukutyeba 17um--175um
    Umngxuma woKwemba (Oomatshini) 0.15mm--6.35mm
    Gqiba umngxuma (Mechanical) 0.10mm-6.30mm
    Ukunyamezelwa kweDiameter(Mechanical) 0.05mm
    Ubhaliso(oomatshini) 0.075mm
    Umgangatho wento 16:1
    Uhlobo lweMaski yeSolder LPI
    SMT Mini.Solder Mask Ububanzi 0.075mm
    Mini.I-Solder Mask Clearance 0.05mm
    I-Plag Hole Diameter 0.25mm--0.60mm
    Ulawulo lwe-Impedans Unyamezelo ±10%
    Ukugqitywa komphezulu / unyango HASL, ENIG, Chem, Tin, Flash Gold, OSP, Gold Finger
    Icala eliphindwe kabini okanye ibhodi ye-Multilayer

    Inkqubo yeMveliso yePCB

    Inkqubo iqala ngokuyila uYilo lwePCB usebenzisa nayiphi na isoftware yokuyila iPCB / isixhobo seCAD (iProteus, uKhozi, Okanye iCAD).

    Onke amanye amanyathelo ngaweNkqubo yokuVelisa yeBhodi yeSekethe eShicileleyo eZingqongqo iyafana ne-Single Sided PCB okanye i-Double Sided PCB okanye i-Multi-layer PCB.

    Inkqubo yeMveliso yePCB

    Q / T Ixesha lokukhokela

    Udidi Ixesha lokukhokela elikhawulezayo Ixesha eliqhelekileyo lokukhokela
    Amacala amabini Iiyure ezingama-24 120hrs
    4 Iileya Iiyure ezingama-48 172hrs
    6 Iileya 72hrs 192hrs
    8 Iileya Iiyure ezingama-96 212hrs
    Iileya ezili-10 120hrs iiyure ezingama-268
    12 Iileya 120hrs 280hrs
    14 Iileya Iiyure ezingama-144 292hrs
    16-20 Iileya Kuxhomekeke kwiimfuno ezithile
    Ngaphezulu kwe20 Layers Kuxhomekeke kwiimfuno ezithile

    Intshukumo ye-ABIS yokulawula i-FR4 PCBS

    Ukulungiswa komngxuma

    Ukususa i-debris ngononophelo kunye nokulungelelanisa iiparamitha zoomatshini bokuqhuba: phambi kokucoca ngobhedu, i-ABIS ihlawula ingqalelo ephezulu kuyo yonke imingxuma kwi-FR4 PCB ephathwayo ukususa inkunkuma, izitenxo zomphezulu, kunye ne-epoxy smear, imingxuma ecocekileyo iqinisekisa ukuba iplating ibambelela ngempumelelo kwiindonga zomngxunya. .kwakhona, ekuqaleni kwenkqubo, iiparamitha zoomatshini bokuqhuba zihlengahlengiswa ngokuchanekileyo.

    Ukulungiswa komphezulu

    Ukuhlawula ngononophelo: abasebenzi bethu bezobuchwepheshe abanamava baya kuqaphela kwangaphambili ukuba ekuphela kwendlela yokuphepha umphumo ombi kukulindela imfuno yokuphathwa okukhethekileyo kunye nokuthatha amanyathelo afanelekileyo ukuqinisekisa ukuba inkqubo yenziwa ngononophelo nangokuchanekileyo.

    Amazinga oKwandiswa kweThermal

    Ukuqhelana nokujongana nezinto ezahlukeneyo, i-ABIS iya kukwazi ukuhlalutya ukudibanisa ukuze kuqinisekiswe ukuba kufanelekile.emva koko ukugcina ukuthembeka kwexesha elide le-CTE (i-coefficient yokwandiswa kwe-thermal), kunye ne-CTE ephantsi, i-CTE engaphantsi, into engenakwenzeka ukuba ifakwe kwimingxuma yokungaphumeleli ukuguquguquka okuphindaphindiweyo kobhedu okwenza udibaniso lwangaphakathi lwangaphakathi.

    Ukukala

    Ulawulo lwe-ABIS i-circuitry ihlaziywa ngeepesenti ezaziwayo ngokulindela le lahleko ukwenzela ukuba iileyile ziya kubuyela kwimilinganiselo yazo eyilelwe emva kokuba umjikelo we-lamination ugqityiwe.kwakhona, usebenzisa izindululo zokukalwa kwesiseko somenzi welaminate ngokudityaniswa nedatha yolawulo lwenkqubo yobalo lwangaphakathi, ukucofa imiba yesikali eya kuthi ihambelane ngokuhamba kwexesha ngaphakathi kuloo ndawo yokuvelisa.

    Umatshini

    Xa kufika ixesha lokwakha i-PCB yakho, i-ABIS qiniseka ukuba ukhetha inezixhobo ezifanelekileyo kunye namava okuyivelisa ngokuchanekileyo kwi-try yokuqala.

    Ulawulo lwemeko

    Umnqophiso woMgangatho we-ABIS
    Ucweyo olusemgangathweni

    BIS isombulula ingxaki PCB aluminiyam?

    Imathiriyeli ekrwada zilawulwa ngokungqongqo:Ireyithi yokupasa kwezinto ezingenayo ingaphezulu kwama-99.9%.Inani lemilinganiselo yokwaliwa ngobuninzi ingaphantsi kwe-0.01%.

    Ukufakwa Kobhedu kuyalawulwa:ifoyile yobhedu esetyenziswa kwiiPCB zeAluminiyam iyajiya xa ithelekiswa.Ukuba ifoyile yobhedu ingaphezulu kwe-3oz nangona kunjalo, i-etching ifuna imbuyekezo yobubanzi.Ngezixhobo ezichanekileyo eziphezulu ezingeniswe eJamani, ububanzi bemin / indawo esinokuyilawula ifikelela kwi-0.01mm.Imbuyekezo yobubanzi bomkhondo iya kuyilwa ngokuchanekileyo ukunqanda umkhondo wobubanzi ngaphandle kokunyamezelana emva kokufakwa.

    UShicilelo lweMaski yeSoda ekumgangatho oPhezulu:Njengoko sonke sisazi, kukho ubunzima ekushicileleni imaski ye-solder ye-aluminium PCB ngenxa yobunzima bobhedu.Oku kungenxa yokuba ukuba umkhondo wobhedu ushinyene kakhulu, ngoko umfanekiso obekiweyo uya kuba nomahluko omkhulu phakathi komkhondo womkhondo kunye nebhodi yesiseko kunye noshicilelo lwemaski ye-solder kuya kuba nzima.Sigxininisa kweyona migangatho iphezulu ye-oyile yemaski ye-solder kuyo yonke inkqubo, ukusuka kwelinye ukuya kushicilelo lwemaski ye-solder amaxesha amabini.

    Ukuveliswa koomatshini:Ukuze ugweme ukunciphisa amandla ombane obangelwa yinkqubo yokuvelisa oomatshini, kubandakanya ukugaya oomatshini, ukubumba kunye ne-v-scoring njl. Ngoko ke, ukuveliswa kwemveliso ephantsi, sibeka phambili ukusebenzisa umbane wokugaya umbane kunye ne-cutter milling cutter.Kwakhona, sihlawula ingqalelo ephezulu ekulungiseni iiparamitha zokomba kunye nokuthintela i-burr ekuveliseni.

    Isatifikethi

    isatifikethi2 (1)
    isatifikethi2 (2)
    isatifikethi2 (4)
    isatifikethi2 (3)

    FAQ

    1.Ziza kujongwa nini iifayile zam zePCB?

    Ihlolwe kwiiyure ezili-12.Nje ukuba umbuzo weNjineli kunye nefayile yokusebenza ihlolwe, siya kuqalisa imveliso.

    2.Zeziphi iziqinisekiso onazo?

    ISO9001, ISO14001,UL USA&USA Canada,IFA16949, SGS, RoHS ingxelo.

    3.Uvavanya njani kwaye ulawule umgangatho?

    IiNkqubo zethu zokuqinisekisa uMgangatho zingezantsi:

    a), uHlolo oluBonakalayo

    b), iFlying probe, isixhobo sokulungisa

    c), Ulawulo lokuphazamiseka

    d), ukubonwa kobuchule bomthengisi

    e), imakroskopu yedijithali ye-metallo yegrafikhi

    f), i-AOI (Uhlolo oluSebenzayo oluSebenzayo)

    4.Uyakwazi ukwenza iiPCB zam kwifayile yomfanekiso?

    Hayi, asikwaziyamkelaiifayile zemifanekiso, ukuba awunayoGerberifayile, ungasithumela isampuli ukuyikhuphela.

    I-PCB&PCBA Inkqubo yokukopa:

    Uyakwazi ukwenza iiPCB zam kwifayile yemifanekiso

    5.Kunjani ngeNkonzo yakho yokuJika ngokukhawuleza?

    Ngexesha lokuhanjiswa kwexesha lingaphezulu kwe-95%

    a), iiyure ezingama-24 zijika ngokukhawuleza kwicala eliphindwe kabini leprototype PCB

    b), iiyure ezingama-48 ze-4-8 umaleko weprototype PCB

    c), iyure e-1 yekoteyishini

    d), iiyure ezi-2 zombuzo wenjineli/ingxelo yesikhalazo

    e), iiyure ze-7-24 zenkxaso yobugcisa / inkonzo ye-odolo / imisebenzi yokuvelisa

    6.Ngaba unayo i-MOQ yeemveliso?Ukuba ewe, ngowuphi owona mlinganiselo uphantsi?

    I-ABIS ayinayo iimfuno ze-MOQ nokuba ze-PCB okanye i-PCBA.

    7.Ingaba inkampani yakho ithatha inxaxheba kumboniso?Ziziphi iinkcukacha?

    Sithatha inxaxheba kwimiboniso minyaka le, eyona yakutshanjeExpo Electronica&ElectronTechExpo eRashiya yangoAprili 2023. Jonga phambili kutyelelo lwakho.

    8.Ziziphi iintlobo zovavanyo onalo?

    I-ABlS yenza i-100% yokuhlola okubonwayo kunye ne-AOl kunye nokwenza uvavanyo lombane, uvavanyo lombane ophezulu, uvavanyo lokulawula i-impedance, i-micro-sectioning, uvavanyo lwe-thermal shock, uvavanyo lwe-solder, uvavanyo lokuthembeka, uvavanyo lwe-insulating resistance, uvavanyo lokucoceka kwe-ionic kunye novavanyo olusebenzayo lwe-PCBA.

    9.Ukuthengiswa kwangaphambili kunye neNkonzo emva koThengiso?

    a), iyure e-1 yocaphulo

    b), iiyure ezi-2 zengxelo yesikhalazo

    c), 7*24 iyure inkxaso yobugcisa

    d), 7*24 inkonzo ye-odolo

    e), 7 * 24 ukuhanjiswa kweyure

    f), 7*24 imveliso run

    10.Yintoni amandla oMveliso weemveliso ezithengiswayo ezishushu?
    Umthamo wemveliso yeemveliso ezithengiswayo ezishushu
    Icala eliphindwe kabini/I-Multilayer PCB Workshop I-Aluminiyam PCB Workshop
    UbuGcisa boBugcisa UbuGcisa boBugcisa
    Imathiriyeli ekrwada: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON Izinto ezibonakalayo: Isiseko seAluminiyam, isiseko sobhedu
    Umaleko: 1 umaleko ukuya kwi-20 Layers Umaleko: 1 umaleko kunye neeLayers ezi-2
    Min.line ububanzi/isithuba: 3mil/3mil(0.075mm/0.075mm) Min.line ububanzi/isithuba: 4mil/4mil(0.1mm/0.1mm)
    Ubungakanani bomngxuma omncinci: 0.1mm(umngxuma wokuvala) Min.Ubungakanani bomngxuma: 12mil(0.3mm)
    Max.Ubungakanani bebhodi: 1200mm * 600mm Ubukhulu bebhodi: 1200mm* 560mm(47in* 22in)
    Ubukhulu bebhodi egqityiweyo: 0.2mm- 6.0mm Ugqitywe ubukhulu bebhodi: 0.3 ~ 5mm
    Ubukhulu befoyile yobhedu: 18um~280um(0.5oz~8oz) Ubukhulu befoyile yobhedu: 35um~210um(1oz~6oz)
    NPTH Ukunyamezela umngxuma: +/-0.075mm, PTH ukunyamezela umngxuma: +/-0.05mm Ukunyamezela indawo yomngxuma: +/-0.05mm
    Ukunyamezelana kolwandlalo: +/-0.13mm Ukunyamezela ulwandlalo lwendlela: +/ 0.15mm;ukunyamezela ulwandlalo lokubetha:+/ 0.1mm
    Umphezulu ugqityiwe: I-HASL engenalo isikhokelo, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP, ukufakwa kwegolide, umnwe wegolide, iCarbon INK. Umphezulu ugqityiwe: Isikhokelo sasimahla seHASL, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP njl
    Ukunyamezela ukunyamezela: +/-10% Hlala ukunyamezela ubunzima: +/-0.1mm
    Ikhono lokuvelisa: 50,000 sqm / ngenyanga MC PCB Ukuvelisa amandla: 10,000 sqm / ngenyanga

  • Ngaphambili:
  • Okulandelayo:

  • Bhala umyalezo wakho apha kwaye uwuthumele kuthi