Izaleko ezi-6 ze-FR4 HDI PCB iSekethe kwi-2oz yobhedu kunye noMphezulu weTin wokuntywiliselwa.
Ulwazi olusisiseko
| Umzekelo No. | PCB-A12 |
| Iphakheji yezothutho | Ukupakishwa kweVacuum |
| Isiqinisekiso | UL, ISO9001&ISO14001,RoHS |
| Isicelo | Ii-elektroniki zabathengi |
| Ubuncinane besithuba/umgca | 0.075mm/3mil |
| Isakhono seMveliso | 50,000 sqm / ngenyanga |
| Ikhowudi ye-HS | 853400900 |
| Imvelaphi | Yenziwe etshayina |
Ingcaciso yeMveliso
HDI PCB Intshayelelo
I-HDI PCB ichazwa njengebhodi yesekethe eprintiweyo enoxinaniso lweengcingo eziphezulu kwindawo yeyunithi kune-PCB eqhelekileyo.Banemigca ecolekileyo kakhulu kunye nezithuba, ii-vias ezincinci kunye neepads zokubamba, kunye nokuxinana okuphezulu kwephedi kunokusebenza kwitekhnoloji ye-PCB eqhelekileyo.I-HDI PCB zenziwa ngee-microvias, zingcwatywe nge-vias kunye ne-lamination elandelelanayo kunye nezixhobo zokugquma kunye ne-conductor wiring ukwenzela ukuxinana okuphezulu kwendlela.
Usetyenziso
I-HDI PCB isetyenziselwa ukunciphisa ubungakanani kunye nobunzima, kunye nokuphucula ukusebenza kombane kwesixhobo.I-HDI PCB yeyona ndlela ilungileyo yokubala umaleko ophezulu kunye nexabiso eliphezulu lelaminate esemgangathweni okanye iibhodi ezilaminethiweyo ngokulandelelanayo.I-HDI idibanisa ii-vias ezingaboniyo kunye nezingcwatywayo ezinceda ukugcina i-PCB real estate ngokuvumela iimpawu kunye nemigca ukuyilwa ngasentla okanye ngaphantsi kwazo ngaphandle kokwenza uqhagamshelwano.Uninzi lwanamhlanje lwe-pitch elungileyo ye-BGA kunye ne-flip-chip yecandelo leenyawo azivumeli ukubaleka umkhondo phakathi kweepads ze-BGA.Iimfama kunye ne-vias ezingcwatywe ziya kudibanisa kuphela iileya ezifuna imidibaniso kuloo ndawo.
Ubuchwephesha kunye nokubanakho
| Into | Isakhono seMveliso |
| Umaleko ubala | I-1-20 imigangatho |
| Izinto eziphathekayo | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, njl. |
| Ubukhulu bebhodi | 0.10mm-8.00mm |
| Ubungakanani obukhulu | 600mmX1200mm |
| Unyamezelo lolwandlalo lweBhodi | +0.10mm |
| Ukunyamezela ukutyeba(t≥0.8mm) | ±8% |
| Ukunyamezela ukutyeba(t<0.8mm) | ±10% |
| I-Insulation Layer Ukutyeba | 0.075mm--5.00mm |
| Ubuncinci bomgca | 0.075mm |
| Ubuncinci besithuba | 0.075mm |
| Out Layer Copper Ukutyeba | 18um--350um |
| Ngaphakathi Layer Copper Ukutyeba | 17um--175um |
| Umngxuma woKwemba (Oomatshini) | 0.15mm--6.35mm |
| Gqiba umngxuma (Mechanical) | 0.10mm-6.30mm |
| Ukunyamezelwa kweDiameter(Mechanical) | 0.05mm |
| Ubhaliso(oomatshini) | 0.075mm |
| Umgangatho wento | 16:1 |
| Uhlobo lweMaski yeSolder | LPI |
| SMT Mini.Solder Mask Ububanzi | 0.075mm |
| Mini.I-Solder Mask Clearance | 0.05mm |
| I-Plag Hole Diameter | 0.25mm--0.60mm |
| Ulawulo lwe-Impedans Unyamezelo | ±10% |
| Ukugqitywa komphezulu / unyango | HASL, ENIG, Chem, Tin, Flash Gold, OSP, Gold Finger |
Inkqubo yeMveliso yePCB
Inkqubo iqala ngokuyila uYilo lwePCB usebenzisa nayiphi na isoftware yokuyila iPCB / isixhobo seCAD (iProteus, uKhozi, Okanye iCAD).
Onke amanye amanyathelo ngaweNkqubo yokuVelisa yeBhodi yeSekethe eShicileleyo eZingqongqo iyafana ne-Single Sided PCB okanye i-Double Sided PCB okanye i-Multi-layer PCB.
Q / T Ixesha lokukhokela
| Udidi | Ixesha lokukhokela elikhawulezayo | Ixesha eliqhelekileyo lokukhokela |
| Amacala amabini | Iiyure ezingama-24 | 120hrs |
| 4 Iileya | Iiyure ezingama-48 | 172hrs |
| 6 Iileya | 72hrs | 192hrs |
| 8 Iileya | Iiyure ezingama-96 | 212hrs |
| Iileya ezili-10 | 120hrs | iiyure ezingama-268 |
| 12 Iileya | 120hrs | 280hrs |
| 14 Iileya | Iiyure ezingama-144 | 292hrs |
| 16-20 Iileya | Kuxhomekeke kwiimfuno ezithile | |
| Ngaphezulu kwe20 Layers | Kuxhomekeke kwiimfuno ezithile | |
Intshukumo ye-ABIS yokulawula i-FR4 PCBS
Ukulungiswa komngxuma
Ukususa i-debris ngononophelo kunye nokulungelelanisa iiparamitha zoomatshini bokuqhuba: phambi kokucoca ngobhedu, i-ABIS ihlawula ingqalelo ephezulu kuyo yonke imingxuma kwi-FR4 PCB ephathwayo ukususa inkunkuma, izitenxo zomphezulu, kunye ne-epoxy smear, imingxuma ecocekileyo iqinisekisa ukuba iplating ibambelela ngempumelelo kwiindonga zomngxunya. .kwakhona, ekuqaleni kwenkqubo, iiparamitha zoomatshini bokuqhuba zihlengahlengiswa ngokuchanekileyo.
Ukulungiswa komphezulu
Ukuhlawula ngononophelo: abasebenzi bethu bezobuchwepheshe abanamava baya kuqaphela kwangaphambili ukuba ekuphela kwendlela yokuphepha umphumo ombi kukulindela imfuno yokuphathwa okukhethekileyo kunye nokuthatha amanyathelo afanelekileyo ukuqinisekisa ukuba inkqubo yenziwa ngononophelo nangokuchanekileyo.
Amazinga oKwandiswa kweThermal
Ukuqhelana nokujongana nezinto ezahlukeneyo, i-ABIS iya kukwazi ukuhlalutya ukudibanisa ukuze kuqinisekiswe ukuba kufanelekile.emva koko ukugcina ukuthembeka kwexesha elide le-CTE (i-coefficient yokwandiswa kwe-thermal), kunye ne-CTE ephantsi, i-CTE engaphantsi, into engenakwenzeka ukuba ifakwe kwimingxuma yokungaphumeleli ukuguquguquka okuphindaphindiweyo kobhedu okwenza udibaniso lwangaphakathi lwangaphakathi.
Ukukala
Ulawulo lwe-ABIS i-circuitry ihlaziywa ngeepesenti ezaziwayo ngokulindela le lahleko ukwenzela ukuba iileyile ziya kubuyela kwimilinganiselo yazo eyilelwe emva kokuba umjikelo we-lamination ugqityiwe.kwakhona, usebenzisa izindululo zokukalwa kwesiseko somenzi welaminate ngokudityaniswa nedatha yolawulo lwenkqubo yobalo lwangaphakathi, ukucofa imiba yesikali eya kuthi ihambelane ngokuhamba kwexesha ngaphakathi kuloo ndawo yokuvelisa.
Umatshini
Xa kufika ixesha lokwakha iPCB yakho, i-ABIS qiniseka ukuba ukhetha inezixhobo ezifanelekileyo kunye namava okuyivelisa
Umnqophiso woMgangatho we-ABIS
Ireyithi yokupasa kwezinto ezingenayo ngaphezu kwe-99.9%, inani lezinga lokulahlwa kobunzima lingaphantsi kwe-0.01%.
Amaziko aqinisekisiweyo e-ABIS alawula zonke iinkqubo eziphambili ukuphelisa yonke imiba enokubakho phambi kokuvelisa.
I-ABIS isebenzisa isoftware ephucukileyo ukwenza uhlalutyo olubanzi lwe-DFM kwidatha engenayo, kwaye isebenzisa iinkqubo zolawulo lomgangatho ophezulu kuyo yonke inkqubo yokwenziwa.
I-ABIS yenza i-100% yokuhlola okubonwayo kunye ne-AOI kunye nokwenza uvavanyo lombane, uvavanyo lombane ophezulu, uvavanyo lokulawula i-impedance, ulwahlulo lwe-micro-sectioning, uvavanyo lwe-thermal shock, uvavanyo lwe-solder, uvavanyo lokuthembeka, uvavanyo lokuxhathisa kunye novavanyo lwe-ionic yococeko.
Isatifikethi
FAQ
Uninzi lwabo luvela kwi-Shengyi Technology Co., Ltd. (SYTECH), oye waba ngumvelisi wesibini we-CCL omkhulu wehlabathi ngokwexabiso lokuthengisa, ukusuka kwi-2013 ukuya kwi-2017. Saseka ubudlelwane bexesha elide lentsebenziswano ukususela ngo-2006. I-FR4 resin material (Imodeli ye-S1000-2, i-S1141, i-S1165, i-S1600) isetyenziselwa ukwenza iibhodi zeesekethe eziprintiweyo ezizimeleyo kunye namacala amabini kunye neebhodi ezininzi.Nazi iinkcukacha eziza kubhekisa kwireferensi yakho.
Kwi-FR-4: I-Sheng Yi, iBhodi yoKumkani, i-Nan Ya, i-Polycard, i-ITEQ, i-ISOLA
Kwi-CEM-1 kunye ne-CEM 3: iSheng Yi, iBhodi yoKumkani
Ngamaxesha amaninzi: Sheng Yi
Kunyango lweUV: Tamura, Chang Xing ( * Umbala okhoyo: oluhlaza) ISolder yecala elinye
Ifoto yolwelo: Tao Yang, Nqana (iFilimu emanzi)
I-Chuan Yu ( * Imibala ekhoyo : Mhlophe, iThengisi enokucingeleka etyheli, emfusa, ebomvu, eBlue, eluhlaza, emnyama)
),1 Iyure yocaphulo
b), iiyure ezi-2 zengxelo yesikhalazo
c), 7*24 iyure inkxaso yobugcisa
d), 7*24 inkonzo ye-odolo
e), 7 * 24 ukuhanjiswa kweyure
f), 7*24 imveliso run
Hayi, asikwazi ukwamkela iifayile zemifanekiso, ukuba awunayo ifayile yeGerber, ungasithumela isampuli ukuyikopisha.
I-PCB&PCBA Inkqubo yokukopa:
IiNkqubo zethu zokuqinisekisa uMgangatho zingezantsi:
a), uHlolo oluBonakalayo
b), iFlying probe, isixhobo sokulungisa
c), Ulawulo lokuphazamiseka
d), ukubonwa kobuchule bomthengisi
e), imakroskopu yedijithali ye-metallo yegrafikhi
f), i-AOI (Uhlolo oluSebenzayo oluSebenzayo)
Ihlolwe kwiiyure ezili-12.Nje ukuba umbuzo weNjineli kunye nefayile yokusebenza ihlolwe, siya kuqalisa imveliso.
Jonga ngeenxa zonke kuwe.Iimveliso ezininzi zivela eTshayina.Ngokucacileyo, oku kunezizathu ezininzi.Ayisekho nje ngexabiso.
Ukulungiselela izicatshulwa kwenziwa ngokukhawuleza.
Ii-odolo zemveliso zigqitywa ngokukhawuleza.Unokuzicwangcisa iiodolo ezicwangciselwe iinyanga kwangaphambili, sinokuzilungiselela ngokukhawuleza nje ukuba i-PO iqinisekisiwe.
Ikhonkco lonikezelo landiswa kakhulu.Yiyo loo nto sinokuthenga lonke icandelo kwiqabane elikhethekileyo ngokukhawuleza.
Abasebenzi abaguquguqukayo nabanomdla.Ngenxa yoko, samkela yonke iodolo.
Inkonzo ye-intanethi ye-24 kwiimfuno ezingxamisekileyo.Iiyure zokusebenza ze +10 iiyure ngosuku.
Iindleko eziphantsi.Akukho xabiso lifihliweyo.Yonga kubasebenzi, i-overhead kunye namalungiselelo.
I-ABIS ayinayo iimfuno ze-MOQ nokuba ze-PCB okanye i-PCBA.
I-ABlS yenza i-100% yokuhlola okubonwayo kunye ne-AOl kunye nokwenza uvavanyo lombane, uvavanyo lombane ophezulu, uvavanyo lokulawula i-impedance, i-micro-sectioning, uvavanyo lwe-thermal shock, uvavanyo lwe-solder, uvavanyo lokuthembeka, uvavanyo lwe-insulating resistance, uvavanyo lokucoceka kwe-ionic kunye novavanyo olusebenzayo lwe-PCBA.
I-ABIS ayinayo iimfuno ze-MOQ nokuba ze-PCB okanye i-PCBA.
| Umthamo wemveliso yeemveliso ezithengiswayo ezishushu | |
| Icala eliphindwe kabini/I-Multilayer PCB Workshop | I-Aluminiyam PCB Workshop |
| UbuGcisa boBugcisa | UbuGcisa boBugcisa |
| Imathiriyeli ekrwada: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Izinto ezibonakalayo: Isiseko seAluminiyam, isiseko sobhedu |
| Umaleko: 1 umaleko ukuya kwi-20 Layers | Umaleko: 1 umaleko kunye neeLayers ezi-2 |
| Min.line ububanzi/isithuba: 3mil/3mil(0.075mm/0.075mm) | Min.line ububanzi/isithuba: 4mil/4mil(0.1mm/0.1mm) |
| Ubungakanani bomngxuma omncinci: 0.1mm(umngxuma wokuvala) | Min.Ubungakanani bomngxuma: 12mil(0.3mm) |
| Max.Ubungakanani bebhodi: 1200mm * 600mm | Ubukhulu bebhodi: 1200mm* 560mm(47in* 22in) |
| Ubukhulu bebhodi egqityiweyo: 0.2mm- 6.0mm | Ugqitywe ubukhulu bebhodi: 0.3 ~ 5mm |
| Ubukhulu befoyile yobhedu: 18um~280um(0.5oz~8oz) | Ubukhulu befoyile yobhedu: 35um~210um(1oz~6oz) |
| NPTH Ukunyamezela umngxuma: +/-0.075mm, PTH ukunyamezela umngxuma: +/-0.05mm | Ukunyamezela indawo yomngxuma: +/-0.05mm |
| Ukunyamezelana kolwandlalo: +/-0.13mm | Ukunyamezela ulwandlalo lwendlela: +/ 0.15mm;ukunyamezela ulwandlalo lokubetha:+/ 0.1mm |
| Umphezulu ugqityiwe: I-HASL engenalo isikhokelo, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP, ukufakwa kwegolide, umnwe wegolide, iCarbon INK. | Umphezulu ugqityiwe: Isikhokelo sasimahla seHASL, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP njl |
| Ukunyamezela ukunyamezela: +/-10% | Hlala ukunyamezela ubunzima: +/-0.1mm |
| Ikhono lokuvelisa: 50,000 sqm / ngenyanga | MC PCB Ukuvelisa amandla: 10,000 sqm / ngenyanga |
