6 iileya Hard Gold PCB Board kunye 3.2mm ubukhulu ibhodi kunye Counter Sink Hole
Ulwazi olusisiseko
| Umzekelo No. | PCB-A37 |
| Iphakheji yezothutho | Ukupakishwa kweVacuum |
| Isiqinisekiso | UL, ISO9001&ISO14001,RoHS |
| Isicelo | Ii-elektroniki zabathengi |
| Ubuncinane besithuba/umgca | 0.075mm/3mil |
| Isakhono seMveliso | 50,000 sqm / ngenyanga |
| Ikhowudi ye-HS | 853400900 |
| Imvelaphi | Yenziwe etshayina |
Ingcaciso yeMveliso
HDI PCB Intshayelelo
I-HDI PCB ichazwa njengebhodi yesekethe eprintiweyo enoxinaniso lweengcingo eziphezulu kwindawo yeyunithi kune-PCB eqhelekileyo.Banemigca ecolekileyo kakhulu kunye nezithuba, ii-vias ezincinci kunye neepads zokubamba, kunye nokuxinana okuphezulu kwephedi kunokusebenza kwitekhnoloji ye-PCB eqhelekileyo.I-HDI PCB zenziwa ngee-microvias, zingcwatywe nge-vias kunye ne-lamination elandelelanayo kunye nezixhobo zokugquma kunye ne-conductor wiring ukwenzela ukuxinana okuphezulu kwendlela.
Usetyenziso
I-HDI PCB isetyenziselwa ukunciphisa ubungakanani kunye nobunzima, kunye nokuphucula ukusebenza kombane kwesixhobo.I-HDI PCB yeyona ndlela ilungileyo yokubala umaleko ophezulu kunye nexabiso eliphezulu lelaminate esemgangathweni okanye iibhodi ezilaminethiweyo ngokulandelelanayo.I-HDI idibanisa ii-vias ezingaboniyo kunye nezingcwatywayo ezinceda ukugcina i-PCB real estate ngokuvumela iimpawu kunye nemigca ukuyilwa ngasentla okanye ngaphantsi kwazo ngaphandle kokwenza uqhagamshelwano.Uninzi lwanamhlanje lwe-pitch elungileyo ye-BGA kunye ne-flip-chip yecandelo leenyawo azivumeli ukubaleka umkhondo phakathi kweepads ze-BGA.Iimfama kunye ne-vias ezingcwatywe ziya kudibanisa kuphela iileya ezifuna imidibaniso kuloo ndawo.
Ubuchwephesha kunye nokubanakho
| INTO | ISAKHONO | INTO | ISAKHONO |
| Iileya | 1-20L | Ubhedu olutyebileyo | 1-6OZ |
| Uhlobo lweeMveliso | HF (High-frequency) &(Radio Frequency) ibhodi, Imedance elawulwa yibhodi, HDIboard, BGA & Fine Pitch board | Solder Mask | Nanya & Taiyo;LRI kunye noMat Red.luhlaza, tyheli, mhlophe, bhlowu, mnyama |
| Izinto ezisisiseko | FR4(Shengyi China,ITEQ, KB A+,HZ),HITG,FrO6,Rogers,Taconic,Argon,Nalco lsola njalo njalo | Umphezulu ogqityiweyo | I-HASL yesiqhelo, i-HASL yasimahla, iFlashGold, ENIG (lmmersion Gold) OSP (Entek), lmmersion TiN, lmmersion Silver, Hard Gold |
| Unyango oluKhethekileyo loMphezulu | I-ENIG(iGolide yokuntywiliselwa) + OSP, ENIG(iGolide yokuntywiliselwa) + uMnwe weGolide, uMnwe weGolide odanyazayo, untywiliselo oluPhila + lomnwe weGolide, iTin yokuntywiliselwa + uMnwe weGolide | ||
| Inkcazo yobuGcisa | Ubuncinane bobubanzi bomgca/isikhewu: 3.5/4mil (i-laser dril) Ubuncinane bobungakanani bomngxuma: 0.15 mm(umatshini wokuqhuba/i-4 mill laser drill) Ubuncinane beRingi yoNyaka: 4mil Ubukhulu beCopper: 6Oz Ubungakanani beMveliso enkulu: 600x1200mm Ukutyeba kwebhodi: D/S: 0.2-70mm,Ii-Mulltilayer: 0.40-7.Omm Min Solder Mask Bridge: ≥0.08mm Umba womlinganiselo: 15:1 Ukuplaga ngesakhono: 0.2-0.8mm | ||
| Ukunyamezelana | Imingxuma eplathiweyo Unyamezelo : ±0.08mm(min±0.05) Ukunyamezelwa komngxuma ongafakwanga: ±O.05min(min+O/-005mm okanye +0.05/Omm) Unyamezelo lwesishwankathelo: ±0.15min(min±0.10mm) Uvavanyo olusebenzayo: Ukumelana nokuvalwa: 50 ohms (isiqhelo) Hlula amandla: 14N/mm Uvavanyo loxinzelelo lwe-Thermal: 265C.20 imizuzwana Ubulukhuni bemaski yeSolder: 6H I-E-test voltage: 50ov±15/-0V 3os I-Warp kunye ne-Twist: 0.7% ( ibhodi yokuvavanya i-semiconductor 0.3%) | ||
Iimpawu-Inzuzo Yethu yeeMveliso
Ngaphezulu kweminyaka eli-15 yamava umenzi kwinkonzo PCB entsimini
Isikali esikhulu sokuvelisa siqinisekisa ukuba ixabiso lokuthenga kwakho lisezantsi.
Umgca wemveliso ophezulu uqinisekisa umgangatho ozinzile kunye nobomi obude
Uvavanyo lwe-100% kuzo zonke iimveliso zePCB ezilungiselelweyo
One-stop Service, sinokunceda ukuthenga amacandelo
Q / T Ixesha lokukhokela
| Udidi | Ixesha lokukhokela elikhawulezayo | Ixesha eliqhelekileyo lokukhokela |
| Amacala amabini | Iiyure ezingama-24 | 120hrs |
| 4 Iileya | Iiyure ezingama-48 | 172hrs |
| 6 Iileya | 72hrs | 192hrs |
| 8 Iileya | Iiyure ezingama-96 | 212hrs |
| Iileya ezili-10 | 120hrs | iiyure ezingama-268 |
| 12 Iileya | 120hrs | 280hrs |
| 14 Iileya | Iiyure ezingama-144 | 292hrs |
| 16-20 Iileya | Kuxhomekeke kwiimfuno ezithile | |
| Ngaphezulu kwe20 Layers | Kuxhomekeke kwiimfuno ezithile | |
Intshukumo ye-ABIS yokulawula i-FR4 PCBS
Ukulungiswa komngxuma
Ukususa i-debris ngononophelo kunye nokulungelelanisa iiparamitha zoomatshini bokuqhuba: phambi kokucoca ngobhedu, i-ABIS ihlawula ingqalelo ephezulu kuyo yonke imingxuma kwi-FR4 PCB ephathwayo ukususa inkunkuma, izitenxo zomphezulu, kunye ne-epoxy smear, imingxuma ecocekileyo iqinisekisa ukuba iplating ibambelela ngempumelelo kwiindonga zomngxunya. .kwakhona, ekuqaleni kwenkqubo, iiparamitha zoomatshini bokuqhuba zihlengahlengiswa ngokuchanekileyo.
Ukulungiswa komphezulu
Ukuhlawula ngononophelo: abasebenzi bethu bezobuchwepheshe abanamava baya kuqaphela kwangaphambili ukuba ekuphela kwendlela yokuphepha umphumo ombi kukulindela imfuno yokuphathwa okukhethekileyo kunye nokuthatha amanyathelo afanelekileyo ukuqinisekisa ukuba inkqubo yenziwa ngononophelo nangokuchanekileyo.
Amazinga oKwandiswa kweThermal
Ukuqhelana nokujongana nezinto ezahlukeneyo, i-ABIS iya kukwazi ukuhlalutya ukudibanisa ukuze kuqinisekiswe ukuba kufanelekile.emva koko ukugcina ukuthembeka kwexesha elide le-CTE (i-coefficient yokwandiswa kwe-thermal), kunye ne-CTE ephantsi, i-CTE engaphantsi, into engenakwenzeka ukuba ifakwe kwimingxuma yokungaphumeleli ukuguquguquka okuphindaphindiweyo kobhedu okwenza udibaniso lwangaphakathi lwangaphakathi.
Ukukala
Ulawulo lwe-ABIS i-circuitry ihlaziywa ngeepesenti ezaziwayo ngokulindela le lahleko ukwenzela ukuba iileyile ziya kubuyela kwimilinganiselo yazo eyilelwe emva kokuba umjikelo we-lamination ugqityiwe.kwakhona, usebenzisa izindululo zokukalwa kwesiseko somenzi welaminate ngokudityaniswa nedatha yolawulo lwenkqubo yobalo lwangaphakathi, ukucofa imiba yesikali eya kuthi ihambelane ngokuhamba kwexesha ngaphakathi kuloo ndawo yokuvelisa.
Umatshini
Xa kufika ixesha lokwakha iPCB yakho, i-ABIS qiniseka ukuba ukhetha inezixhobo ezifanelekileyo kunye namava okuyivelisa
Umnqophiso woMgangatho we-ABIS
Ireyithi yokupasa kwezinto ezingenayo ngaphezu kwe-99.9%, inani lezinga lokulahlwa kobunzima lingaphantsi kwe-0.01%.
Amaziko aqinisekisiweyo e-ABIS alawula zonke iinkqubo eziphambili ukuphelisa yonke imiba enokubakho phambi kokuvelisa.
I-ABIS isebenzisa isoftware ephucukileyo ukwenza uhlalutyo olubanzi lwe-DFM kwidatha engenayo, kwaye isebenzisa iinkqubo zolawulo lomgangatho ophezulu kuyo yonke inkqubo yokwenziwa.
I-ABIS yenza i-100% yokuhlola okubonwayo kunye ne-AOI kunye nokwenza uvavanyo lombane, uvavanyo lombane ophezulu, uvavanyo lokulawula i-impedance, ulwahlulo lwe-micro-sectioning, uvavanyo lwe-thermal shock, uvavanyo lwe-solder, uvavanyo lokuthembeka, uvavanyo lokuxhathisa kunye novavanyo lwe-ionic yococeko.
Isatifikethi
FAQ
Uninzi lwabo luvela kwi-Shengyi Technology Co., Ltd. (SYTECH), oye waba ngumvelisi wesibini we-CCL omkhulu wehlabathi ngokwexabiso lokuthengisa, ukusuka kwi-2013 ukuya kwi-2017. Saseka ubudlelwane bexesha elide lentsebenziswano ukususela ngo-2006. I-FR4 resin material (Imodeli ye-S1000-2, i-S1141, i-S1165, i-S1600) isetyenziselwa ukwenza iibhodi zeesekethe eziprintiweyo ezizimeleyo kunye namacala amabini kunye neebhodi ezininzi.Nazi iinkcukacha eziza kubhekisa kwireferensi yakho.
Kwi-FR-4: I-Sheng Yi, iBhodi yoKumkani, i-Nan Ya, i-Polycard, i-ITEQ, i-ISOLA
Kwi-CEM-1 kunye ne-CEM 3: iSheng Yi, iBhodi yoKumkani
Ngamaxesha amaninzi: Sheng Yi
Kunyango lweUV: Tamura, Chang Xing ( * Umbala okhoyo: oluhlaza) ISolder yecala elinye
Ifoto yolwelo: Tao Yang, Nqana (iFilimu emanzi)
I-Chuan Yu ( * Imibala ekhoyo : Mhlophe, iThengisi enokucingeleka etyheli, emfusa, ebomvu, eBlue, eluhlaza, emnyama)
),1 Iyure yocaphulo
b), iiyure ezi-2 zengxelo yesikhalazo
c), 7*24 iyure inkxaso yobugcisa
d), 7*24 inkonzo ye-odolo
e), 7 * 24 ukuhanjiswa kweyure
f), 7*24 imveliso run
Hayi, asikwazi ukwamkela iifayile zemifanekiso, ukuba awunayo ifayile yeGerber, ungasithumela isampuli ukuyikopisha.
I-PCB&PCBA Inkqubo yokukopa:
IiNkqubo zethu zokuqinisekisa uMgangatho zingezantsi:
a), uHlolo oluBonakalayo
b), iFlying probe, isixhobo sokulungisa
c), Ulawulo lokuphazamiseka
d), ukubonwa kobuchule bomthengisi
e), imakroskopu yedijithali ye-metallo yegrafikhi
f), i-AOI (Uhlolo oluSebenzayo oluSebenzayo)
Ngexesha lokuhanjiswa kwexesha lingaphezulu kwe-95%
a), iiyure ezingama-24 zijika ngokukhawuleza kwicala eliphindwe kabini leprototype PCB
b),48hours for 4-8 umaleko prototype PCB
c), iyure eyi-1 yocaphulo
d), iiyure ezi-2 zombuzo wenjineli / impendulo yesikhalazo
e), iiyure ze-7-24 zenkxaso yobugcisa / inkonzo ye-odolo / imisebenzi yokuvelisa
I-ABIS ayinayo iimfuno ze-MOQ nokuba ze-PCB okanye i-PCBA.
I-ABlS yenza i-100% yokuhlola okubonwayo kunye ne-AOl kunye nokwenza uvavanyo lombane, uvavanyo lombane ophezulu, uvavanyo lokulawula i-impedance, i-micro-sectioning, uvavanyo lwe-thermal shock, uvavanyo lwe-solder, uvavanyo lokuthembeka, uvavanyo lwe-insulating resistance, uvavanyo lokucoceka kwe-ionic kunye novavanyo olusebenzayo lwe-PCBA.
Amashishini angundoqo e-ABIS: Ulawulo lwezoShishino, ezoNxibelelwano ngoNxibelelwano, iiMveliso zeeMoto kunye nezoNyango.IMarike ePhambili ye-ABIS: 90% iMarike yaMazwe ngaMazwe (40% -50% yase-USA, i-35% yaseYurophu, i-5% yaseRashiya kunye ne-5% -10% ye-East Asia) kunye ne-10% yeMarike yasekhaya.
| Umthamo wemveliso yeemveliso ezithengiswayo ezishushu | |
| Icala eliphindwe kabini/I-Multilayer PCB Workshop | I-Aluminiyam PCB Workshop |
| UbuGcisa boBugcisa | UbuGcisa boBugcisa |
| Imathiriyeli ekrwada: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Izinto ezibonakalayo: Isiseko seAluminiyam, isiseko sobhedu |
| Umaleko: 1 umaleko ukuya kwi-20 Layers | Umaleko: 1 umaleko kunye neeLayers ezi-2 |
| Min.line ububanzi/isithuba: 3mil/3mil(0.075mm/0.075mm) | Min.line ububanzi/isithuba: 4mil/4mil(0.1mm/0.1mm) |
| Ubungakanani bomngxuma omncinci: 0.1mm(umngxuma wokuvala) | Min.Ubungakanani bomngxuma: 12mil(0.3mm) |
| Max.Ubungakanani bebhodi: 1200mm * 600mm | Ubukhulu bebhodi: 1200mm* 560mm(47in* 22in) |
| Ubukhulu bebhodi egqityiweyo: 0.2mm- 6.0mm | Ugqitywe ubukhulu bebhodi: 0.3 ~ 5mm |
| Ubukhulu befoyile yobhedu: 18um~280um(0.5oz~8oz) | Ubukhulu befoyile yobhedu: 35um~210um(1oz~6oz) |
| NPTH Ukunyamezela umngxuma: +/-0.075mm, PTH ukunyamezela umngxuma: +/-0.05mm | Ukunyamezela indawo yomngxuma: +/-0.05mm |
| Ukunyamezelana kolwandlalo: +/-0.13mm | Ukunyamezela ulwandlalo lwendlela: +/ 0.15mm;ukunyamezela ulwandlalo lokubetha:+/ 0.1mm |
| Umphezulu ugqityiwe: I-HASL engenalo isikhokelo, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP, ukufakwa kwegolide, umnwe wegolide, iCarbon INK. | Umphezulu ugqityiwe: Isikhokelo sasimahla seHASL, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP njl |
| Ukunyamezela ukunyamezela: +/-10% | Hlala ukunyamezela ubunzima: +/-0.1mm |
| Ikhono lokuvelisa: 50,000 sqm / ngenyanga | MC PCB Ukuvelisa amandla: 10,000 sqm / ngenyanga |
