Customizable 6 Layers Rigid-Flex PCB Board ene-3.0oz Copper kunye ne-ENIG 2u” Surface Finish
Ulwazi olusisiseko
| Umzekelo No. | PCB-A35 |
| Iphakheji yezothutho | Ukupakishwa kweVacuum |
| Isiqinisekiso | UL, ISO9001&ISO14001,RoHS |
| Iingcaciso | IPC Udidi 2 |
| Ubuncinane besithuba/umgca | 0.075mm/3mil |
| Ulawulo lwe-impedance | 50±10% |
| Isakhono seMveliso | 720, 000 M2/Ngonyaka |
| Imvelaphi | Yenziwe etshayina |
Ingcaciso yeMveliso
Rigid-flexible eziprintiweyo iibhodi iibhodi iibhodi
Intsingiselo yokoqobo ye "rigid-flex" indibaniselwano izibonelelo zombini bhetyebhetye kunye neebhodi ezomeleleyo.Ibonwa njengesekethe ezimbini-kwinye idityaniswe ngemingxunya egcweleyo.Iisekethe eziguquguqukayo eziqinileyo zenza uxinano lwecandelo eliphezulu ngelixa zingena kwizithuba eziqingqiweyo nezingaqhelekanga.
Iibhodi zeesekethe eziprintiweyo eziguquguqukayo zinemijikelezo emininzi eguquguqukayo yesekethe yangaphakathi ekhethiweyo edityaniswe kunye kusetyenziswa ifilimu ye-epoxy pre-preg bonding, efana ne-multilayer flexible circuit.Iisekethe eziguquguqukayo eziqinileyo zisetyenzisiwe kumashishini omkhosi kunye ne-aerospace ngaphezulu kweminyaka engama-20.Kwiibhodi ezininzi zesekethe eziguquguqukayo.
Ubuchwephesha kunye nokubanakho
| Into | Isakhono seMveliso |
| Umaleko ubala | 1-32 |
| Izinto eziphathekayo | FR-4, High TG FR-4, PTFE, Aluminium Base, Cu base, Rogers, Teflon, njl. |
| Ubungakanani obukhulu | 600mm X1200mm |
| Unyamezelo lolwandlalo lweBhodi | ±0.13mm |
| Ukutyeba kweBhodi | 0.20mm--8.00mm |
| Ukunyamezela ukutyeba(t≥0.8mm) | ±10% |
| Ukutyeba kweTolerancc(t<0.8mm) | ±0.1mm |
| I-Insulation Layer Thickncss | 0.075mm--5.00mm |
| Ubuncinci Iine | 0.075mm |
| Ubuncinci besithuba | 0.075mm |
| Out Layer Copper Ukutyeba | 18um--350um |
| Ngaphakathi Layer Copper Ukutyeba | 17um--175um |
| Umngxuma woKwemba (Oomatshini) | 0.15mm--6.35mm |
| Gqiba umngxuma (Mechanical) | 0.10mm--6.30mm |
| Ukunyamezelwa kweDiameter(Mechanical) | 0.05mm |
| Ubhaliso(oomatshini) | 0.075mm |
| Aspecl Umlinganiselo | 16:01 |
| Uhlobo lweMaski yeSolder | LPI |
| SMT Mini.Solder Mask Ububanzi | 0.075mm |
| Mini.Solder Mask Clearance | 0.05mm |
| I-Plag Hole Diameter | 0.25mm--0.60mm |
| Ukunyamezelwa koLawulo lwe-Impedans | 10% |
| Umphezulu Gqiba | HASL/HASL-LF, ENIG, iTin yokuntywiliselwa/iSilver, iFlash Gold, iOSP, umnwe weGolide, iGolide eNqinileyo |
Isakhono sokuVelisa-(Flex)
| izinto | iyunithi | ||||||
| Iileya eziphezulu | Umaleko | 10 | |||||
| Izinto ezisisiseko (iPolymide) | μm | 9, 12, 18, 35, 70 | |||||
| Ifoyile yobhedu | μm | 18,35,70 | |||||
| Isigqubuthelo (Polymide) | μm | 27.5, 37.5, 50, 75 | |||||
| Isamente yeThermosetting | μm | 13, 25 | |||||
| Ubungakanani bePaneli enkulu | mm | 250*800 | I-250 * 1500 ye-10 Layers | ||||
| Ubuncinci bePaneli yobungakanani | mm | Kuxhomekeke kumthengi | |||||
| Ukutyeba kweBhodi okuGqibeleleyo okuphezulu | mm | 0.7 | |||||
| Ubuncinci beBhodi obuGqibeleleyo ukutyeba | mm | 0.057mm | |||||
| Ubungakanani bomngxuma Ukunyamezela | mm | ±0.05mm | |||||
| Ubuncinci boMngxuma | mm | 0.1mm | |||||
| Ubuncinci ngePad yomngxuma | mm | 0.3mm | 0.25mm Ngokukodwa | ||||
| Maximal Base Copper Ukutyeba | OZ | 2 | |||||
| Ubuncinci beSiseko sokutyeba kobhedu | OZ | 1/4 | |||||
| Ukutyeba kweCopper Plating | μm | 8-20 | |||||
| PTH Ukutyeba kobhedu | μm | 8~20 | |||||
| Ubuncinane boBububanzi bomgca/Isithuba | mm | 0.05 | |||||
| Umphezulu Ugqityiwe | / | Ni,Au,Sn | |||||
I-Flexible PCB Lead Time
| Iqela elincinciUmthamo ≤1 square metre | Iintsuku Zokusebenza | Imveliso enkulu | Iintsuku Zokusebenza |
| Icala-linye | 3-4 | Icala-linye | 8-10 |
| 2-4 imigangatho | 4-5 | 2-4 imigangatho | 10-12 |
| 6-8 imigangatho | 10-12 | 6-8 imigangatho | 14-18 |
Izinto ezilungileyo ze-ABIS
- Izixhobo ezikumgangatho ophezulu-isantya esiphezulu sokuKhetha kunye nokubeka oomatshini abanokuqhuba malunga nama-25,000 amacandelo e-SMD ngeyure.
- Ubuchule obuphezulu bokubonelela nge-60K Sqm ngenyanga-Ibonelela ngevolumu ephantsi kunye nemveliso yePCB efunekayo, kunye nemveliso enkulu.
- Iqela lobunjineli bobuchwephesha-iinjineli ezingama-40 kunye nendlu yazo yezixhobo, eyomeleleyo kwi-OEM.Inika iinketho ezimbini ezilula: Ulwazi oluqhelekileyo kunye nomgangatho onzulu we-IPC Class Class II kunye ne-III
Sinikezela ngenkonzo ebanzi yokujika i-EMS kubathengi abafuna ukuba sihlanganise i-PCB kwi-PCBA, kubandakanywa neeprototypes, iiprojekthi ze-NPI, iivolumu ezincinci kunye neziphakathi.Kwakhona siyakwazi ukukhangela onke amacandelo kwiprojekthi yakho yendibano yePCB.Iinjineli zethu kunye neqela lokukhangela banamava atyebileyo kwishishini lokubonelela kunye ne-EMS, ngolwazi olunzulu kwindibano ye-SMT esivumela ukuba sisombulule yonke imiba yemveliso.Inkonzo yethu ingabizi kakhulu, iguquguquka, kwaye ithembekile.Sanelisa abathengi kuwo onke amashishini amaninzi aquka ezonyango, amashishini, ezemoto, kunye nombane wabathengi.
Isatifikethi
FAQ
Amashishini angundoqo e-ABIS: Ulawulo lwezoShishino, ezoNxibelelwano ngoNxibelelwano, iiMveliso zeeMoto kunye nezoNyango.IMarike ePhambili ye-ABIS: 90% iMarike yaMazwe ngaMazwe (40% -50% yase-USA, i-35% yaseYurophu, i-5% yaseRashiya kunye ne-5% -10% ye-East Asia) kunye ne-10% yeMarike yasekhaya.
Ababoneleli abaPhambili (FR4): Kingboard (Hong Kong), NanYa (Taiwan), kunye neShengyi (China), Ukuba abanye, nceda RFQ.
IiNkqubo zethu zokuqinisekisa uMgangatho zingezantsi:
a), uHlolo oluBonakalayo
b), iFlying probe, isixhobo sokulungisa
c), Ulawulo lokuphazamiseka
d), ukubonwa kobuchule bomthengisi
e), Imakroskopu yeDijithali ye-metallog
f), i-AOI (Uhlolo oluSebenzayo oluSebenzayo)
Ngokuqhelekileyo iintsuku ezi-2-3 zokwenza isampuli.Ixesha elikhokelayo lokuvelisa ngobuninzi liya kuxhomekeka kubungakanani bomyalelo kunye nexesha lonyaka obeka ngalo umyalelo.
IiNkqubo zethu zokuqinisekisa uMgangatho zingezantsi:
a), uHlolo oluBonakalayo
b), iFlying probe, isixhobo sokulungisa
c), Ulawulo lokuphazamiseka
d), ukubonwa kobuchule bomthengisi
e), Imakroskopu yeDijithali ye-metallog
f), i-AOI (Uhlolo oluSebenzayo oluSebenzayo)
I-ABlS yenza i-100% yokuhlola okubonwayo kunye ne-AOl kunye nokwenza uvavanyo lombane, uvavanyo lombane ophezulu, uvavanyo lwe-impedance control, i-micro-sectioning, uvavanyo lokutshatyalaliswa kwe-thermal, uvavanyo lwe-solder, uvavanyo lokuthembeka, uvavanyo lokunganyangeki., uvavanyo lokucoceka kwe-ionickunye novavanyo olusebenzayo lwe-PCBA.
I-ABlS yenza i-100% yokuhlola okubonwayo kunye ne-AOl kunye nokwenza uvavanyo lombane, uvavanyo lombane ophezulu, uvavanyo lokulawula i-impedance, i-micro-sectioning, uvavanyo lwe-thermal shock, uvavanyo lwe-solder, uvavanyo lokuthembeka, uvavanyo lwe-insulating resistance, uvavanyo lokucoceka kwe-ionic kunye novavanyo olusebenzayo lwe-PCBA.
I-ABIS ayinayo iimfuno ze-MOQ nokuba ze-PCB okanye i-PCBA.
Ngexesha lokuhanjiswa kwexesha lingaphezulu kwe-95%
a), iiyure ezingama-24 zijika ngokukhawuleza kwicala eliphindwe kabini leprototype PCB
b), iiyure ezingama-48 ze-4-8 umaleko weprototype PCB
c), iyure e-1 yekoteyishini
d), iiyure ezi-2 zombuzo wenjineli/ingxelo yesikhalazo
e), iiyure ze-7-24 zenkxaso yobugcisa / inkonzo ye-odolo / imisebenzi yokuvelisa
