Customized Wearable 4 Layers Rigid-Flex PCB ibhodi yesekethe China FPC
Ulwazi olusisiseko
| Umzekelo No. | PCB-A6 |
| Iphakheji yezothutho | Ukupakishwa kweVacuum |
| Isiqinisekiso | UL, ISO9001&ISO14001,RoHS |
| Ubuncinane besithuba/umgca | 0.075mm/3mil |
| Ulawulo lwe-impedance | 100±10% |
| Isakhono seMveliso | 720, 000 M2/Ngonyaka |
| Imvelaphi | Yenziwe etshayina |
| Isicelo | Ii-elektroniki zabathengi |
Ingcaciso yeMveliso
I-ABIS iyiphatha njani iSekethe eGuquguqukayo eGuquguqukayo?
Ukukwazi ukubumba indibano yokugqibela yeePCBs eziqinileyo neziguquguqukayo ukuze zilingane nendawo ebiyelweyo yemveliso yeyona nto iphambili yeebhodi zeesekethe eziguquguqukayo.Nazi iingcebiso ezi-2 ongazibandakanya kwiprojekthi yakho yoyilo elukhuni-flex:
Ukwandisa ukuthembeka komkhondo: Ukugoba okunyamezela iisekethe zefleksi kuthetha ukuba ubhedu kunokwenzeka ukuba ludilize ngaphezu kwebhodi eqinileyo.Ukongezwa kobhedu kwi-substrate kungaphantsi kwe-FR4 PCB ngokunjalo.
Yomeleza umkhondo kunye ne-vias ngee-teardrops: Ukuba ayilawulwa, ukugoba i-substrate kunokukhokelela kwi-delamination kunye nokusilela kwemveliso.Umkhondo kunye ne-vias, nangona kunjalo, zinokuqiniswa ukunqanda i-delamination, zivelise isivuno esingcono kwimveliso ngokunika unyamezelo olongezelelekileyo lokomba.
Ubuchwephesha kunye nokubanakho
| Into | Spec. |
| Iileya | 1-8 |
| Ukutyeba kweBhodi | 0.1mm-8.0mm |
| Izinto eziphathekayo | Polymide, PET, PEN, FR4 |
| Ubungakanani bePaneli enkulu | 600mm×1200mm |
| Ubungakanani boMngxuma omncinci | 0.1mm |
| Ububanzi bomgca obuncinci/iSithuba | 3mil(0.075mm) |
| Unyamezelo lolwandlalo lweBhodi | Ubukhulu 0.10mm |
| I-Insulation Layer Ukutyeba | 0.075mm--5.00mm |
| Ukutyeba kokugqibela | 0.0024''-0.16'' (0.06-2.4.00mm) |
| Umngxuma woKwemba (Oomatshini) | 17um--175um |
| Gqiba umngxuma (oomatshini) | 0.10mm--6.30mm |
| Ukunyamezelwa kweDiameter (Mechanical) | 0.05mm |
| Ubhaliso (Ngoomatshini) | 0.075mm |
| Umgangatho wento | 16:1 |
| Uhlobo lweMaski yeSolder | LPI |
| I-SMT Mini.Solder Mask Ububanzi | 0.075mm |
| Mini.I-Solder Mask Clearance | 0.05mm |
| I-Plag Hole Diameter | 0.25mm--0.60mm |
| Ukunyamezelwa koLawulo lwe-Impedans | 士10% |
| Ukugqitywa komphezulu | ENIG, Chem.I-Tin/Sn, iFlash Gold |
| Imaski yesolder | Buhlaza/Mthubi/Mnyama/Mhlophe/Bomvu/Bhlowu |
| Silkscreen | Bomvu/Mthubi/Mnyama/Mhlophe |
| Isatifikethi | UL, ISO 9001, ISO14001, IATF16949 |
| Isicelo esiKhethekileyo | Umngxunya oyimfama, umnwe weGolide, iBGA, i-inki yeCarbon, imaski ebonwayo, inkqubo yeVIP, ukubekwa komphetho, imingxunya enesiqingatha |
| Ababoneleli bezinto eziphathekayo | Shengyi, ITEQ, Taiyo, njl. |
| Iphakheji eqhelekileyo | Vacuum+Ibhokisi |
I-Flexible PCB Lead Time
| Iqela elincinciUmthamo ≤1 square metre | Iintsuku Zokusebenza | Imveliso enkulu | Iintsuku Zokusebenza |
| Icala-linye | 3-4 | Icala-linye | 8-10 |
| 2-4 imigangatho | 4-5 | 2-4 imigangatho | 10-12 |
| 6-8 imigangatho | 10-12 | 6-8 imigangatho | 14-18 |
Umnqophiso woMgangatho we-ABIS
Ireyithi yokupasa kwezinto ezingenayo ngaphezu kwe-99.9%, inani lezinga lokulahlwa kobunzima lingaphantsi kwe-0.01%.
Amaziko aqinisekisiweyo e-ABIS alawula zonke iinkqubo eziphambili ukuphelisa yonke imiba enokubakho phambi kokuvelisa.
I-ABIS isebenzisa isoftware ephucukileyo ukwenza uhlalutyo olubanzi lwe-DFM kwidatha engenayo, kwaye isebenzisa iinkqubo zolawulo lomgangatho ophezulu kuyo yonke inkqubo yokwenziwa.
I-ABIS yenza i-100% yokuhlola okubonwayo kunye ne-AOI kunye nokwenza uvavanyo lombane, uvavanyo lombane ophezulu, uvavanyo lokulawula i-impedance, ulwahlulo lwe-micro-sectioning, uvavanyo lwe-thermal shock, uvavanyo lwe-solder, uvavanyo lokuthembeka, uvavanyo lokuxhathisa kunye novavanyo lwe-ionic yococeko.
Imephu yeNdlela yeTekhnoloji
| Iteknoloji | 2019 | 2020 | 2021 |
| Umaleko | 20 | 26 | 32 |
| Ubukhulu bebhodi ubukhulu mm | 6 | 7 | 8 |
| Ubungqingqwa bebhodi encinci mm | 0.4 | 0.3 | 0.2 |
| Ubukhulu bobukhulu bephaneli/ubungakanani beepcs mm | 610*910 /580*850 | 620*1000 /580*950 | 620*1000 /580*950 |
| Ubungqingqwa beMin Core mm(ngaphandle kobhedu) | 0.075 | 0.05 | 0.05 |
| Ubukhulu bobhedu oz | Umaleko wangaphakathi: 5oz; Umaleko wangaphandle: 6oz | Uluhlu lwangaphakathi: 6oz; Umaleko wangaphandle: 10oz | Umaleko wangaphakathi: 6oz Umaleko wangaphandle: 10oz |
| Ubuncinci ububanzi/isithuba μm | 75/75 | 65/65 | 50/50 |
| Min Mec umngxuma mm | 0.20 | 0.15 | 0.15 |
| Min Laser yokomba μm | 75 | 75 | 65 |
| Umgangatho wento | 13:1 | 16:1 | 16:1 |
| MAX HDI Aspect ratio | 0.8:1 | 1:1 | 1:1 |
| Ubhaliso phakathi kweeleya(≥10L) μm | 125 | 100 | 76 |
| Ukunyamezela ulawulo lokunyamezela | ±10% | ±8% | ±8% |
| I-drill yangasemva μm | ± 75 | ± 75 | ± 75 |
| Inkqubo ekhethekileyo | I-POV(VIPPO) 、 I-RF ephezulu | ||
| Ukugqitywa komphezulu | ENIG, ukucakwa kwegolide, HASL(HF), OSP, inkonkxa yokuntywiliselwa, isilivere yokuntywiliselwa | ||
Isatifikethi
FAQ
UmThengi ngamnye uya kuba nentengiso yokunxibelelana nawe.Iiyure zethu zokusebenza: AM 9:00-PM 19:00 (Ixesha laseBeijing) ukusuka ngoMvulo ukuya ngoLwesihlanu.Siza kuphendula i-imeyile yakho ngokukhawuleza ngexesha lethu lokusebenza.Kwaye ungaqhagamshelana neentengiso zethu ngeselfowuni ukuba zingxamisekile.
Ababoneleli abaPhambili (FR4): Kingboard (Hong Kong), NanYa (Taiwan), kunye neShengyi (China), Ukuba abanye, nceda RFQ.
IiNkqubo zethu zokuqinisekisa uMgangatho zingezantsi:
a), uHlolo oluBonakalayo
b), iFlying probe, isixhobo sokulungisa
c), Ulawulo lokuphazamiseka
d), ukubonwa kobuchule bomthengisi
e), Imakroskopu yeDijithali ye-metallog
f), i-AOI (Uhlolo oluSebenzayo oluSebenzayo)
Ngokuqhelekileyo iintsuku ezi-2-3 zokwenza isampuli.Ixesha elikhokelayo lokuvelisa ngobuninzi liya kuxhomekeka kubungakanani bomyalelo kunye nexesha lonyaka obeka ngalo umyalelo.
IiNkqubo zethu zokuqinisekisa uMgangatho zingezantsi:
a), uHlolo oluBonakalayo
b), iFlying probe, isixhobo sokulungisa
c), Ulawulo lokuphazamiseka
d), ukubonwa kobuchule bomthengisi
e), Imakroskopu yeDijithali ye-metallog
f), i-AOI (Uhlolo oluSebenzayo oluSebenzayo)
ISO9001, ISO14001,UL USA&USA Canada,IFA16949, SGS, RoHS ingxelo.
I-ABlS yenza i-100% yokuhlola okubonwayo kunye ne-AOl kunye nokwenza uvavanyo lombane, uvavanyo lombane ophezulu, uvavanyo lokulawula i-impedance, i-micro-sectioning, uvavanyo lwe-thermal shock, uvavanyo lwe-solder, uvavanyo lokuthembeka, uvavanyo lwe-insulating resistance, uvavanyo lokucoceka kwe-ionic kunye novavanyo olusebenzayo lwe-PCBA.
Nceda uthumele uphenyo lweenkcukacha kuthi, njengeNombolo yeNtengiso, ubungakanani bento nganye, isicelo soMgangatho, iLogo, iMimiselo yeNtlawulo, indlela yoThutho, indawo yokukhutshwa, njl njl. Siya kukwenzela i-quotation echanekileyo ngokukhawuleza.
Ngexesha lokuhanjiswa kwexesha lingaphezulu kwe-95%
a), iiyure ezingama-24 zijika ngokukhawuleza kwicala eliphindwe kabini leprototype PCB
b), iiyure ezingama-48 ze-4-8 umaleko weprototype PCB
c), iyure e-1 yekoteyishini
d), iiyure ezi-2 zombuzo wenjineli/ingxelo yesikhalazo
e), iiyure ze-7-24 zenkxaso yobugcisa / inkonzo ye-odolo / imisebenzi yokuvelisa
