LED Single-side MC PCB Aluminium Base Circuit Board LED PCB
Ulwazi olusisiseko
Umzekelo No. | PCB-A15 |
Iphakheji yezothutho | Ukupakishwa kweVacuum |
Isiqinisekiso | UL, ISO9001&ISO14001,RoHS |
Iingcaciso | IPC Udidi 2 |
Ubuncinane besithuba/umgca | 0.075mm/3mil |
Isakhono seMveliso | 10,000 sqm / ngenyanga |
Ikhowudi ye-HS | 8534009000 |
Imvelaphi | Yenziwe etshayina |
Ingcaciso yeMveliso
Into | Spec. |
Iileya | 1~2 |
Ukutyeba okuqhelekileyo kweBhodi yokuQeda | 0.3-5mm |
Izinto eziphathekayo | Isiseko seAluminiyam, isiseko sobhedu |
Ubungakanani bePaneli enkulu | 1200mm*560mm(47in*22in) |
Ubungakanani boMngxuma omncinci | 12mil(0.3mm) |
Ububanzi bomgca obuncinci/iSithuba | 3mil(0.075mm) |
Ukutyeba kweFoil yobhedu | 35μm-210μm(1oz-6oz) |
Ubutyebe beKopolo obuqhelekileyo | 18μm, 35μm, 70μm, 105μm. |
Hlala Ukutyeba Ukunyamezela | +/-0.1mm |
Unyamezelo lolwandlalo lweNdlela | +/-0.15mm |
Ukunyamezela ulwandlalo ngokubetha | +/-0.1mm |
Uhlobo lweMaski yeSolder | I-LPI(umfanekiso wefoto elulwelo) |
Mini.I-Solder Mask Clearance | 0.05mm |
I-Plag Hole Diameter | 0.25mm--0.60mm |
Ukunyamezelwa koLawulo lwe-Impedans | +/-10% |
Ukugqitywa komphezulu | Khokela i-HASL yasimahla, igolide yokuntywiliselwa (ENIG), isiliva sokuntywiliselwa, i-OSP, njl |
Solder Mask | Isiko |
Silkscreen | Isiko |
Ubuchule beMveliso ye-MC PCB | 10,000 sqm / ngenyanga |
Q / T Ixesha lokukhokela
Njengesiqhelo sangoku, ikakhulu senza i-PCB ye-aluminium enye, ngelixa kunzima ukwenza i-PCB ye-aluminiyam emacala amabini.
IBatch Volume encinci ≤1 square metre | Iintsuku Zokusebenza | Imveliso enkulu >1 square metres | Iintsuku Zokusebenza |
Icala Elilodwa | Iintsuku ezi-3-4 | Icala Elilodwa | Iiveki ezi-2-4 |
Amacala amabini | Iintsuku ezi-6-7 | Amacala amabini | Iiveki ezi-2.5-5 |
Ulawulo lwemeko
BIS isombulula ingxaki PCB aluminiyam?
Imathiriyeli ekrwada zilawulwa ngokungqongqo:Ireyithi yokupasa kwezinto ezingenayo ingaphezulu kwama-99.9%.Inani lemilinganiselo yokwaliwa ngobuninzi ingaphantsi kwe-0.01%.
Ukufakwa Kobhedu kuyalawulwa:ifoyile yobhedu esetyenziswa kwiiPCB zeAluminiyam iyajiya xa ithelekiswa.Ukuba ifoyile yobhedu ingaphezulu kwe-3oz nangona kunjalo, i-etching ifuna imbuyekezo yobubanzi.Ngezixhobo ezichanekileyo eziphezulu ezingeniswe eJamani, ububanzi bemin / indawo esinokuyilawula ifikelela kwi-0.01mm.Imbuyekezo yobubanzi bomkhondo iya kuyilwa ngokuchanekileyo ukunqanda umkhondo wobubanzi ngaphandle kokunyamezelana emva kokufakwa.
UShicilelo lweMaski yeSoda ekumgangatho oPhezulu:Njengoko sonke sisazi, kukho ubunzima ekushicileleni imaski ye-solder ye-aluminium PCB ngenxa yobunzima bobhedu.Oku kungenxa yokuba ukuba umkhondo wobhedu ushinyene kakhulu, ngoko umfanekiso obekiweyo uya kuba nomahluko omkhulu phakathi komkhondo womkhondo kunye nebhodi yesiseko kunye noshicilelo lwemaski ye-solder kuya kuba nzima.Sigxininisa kweyona migangatho iphezulu ye-oyile yemaski ye-solder kuyo yonke inkqubo, ukusuka kwelinye ukuya kushicilelo lwemaski ye-solder amaxesha amabini.
Ukuveliswa koomatshini:Ukuze ugweme ukunciphisa amandla ombane obangelwa yinkqubo yokuvelisa oomatshini, kubandakanya ukugaya oomatshini, ukubumba kunye ne-v-scoring njl. Ngoko ke, ukuveliswa kwemveliso ephantsi, sibeka phambili ukusebenzisa umbane wokugaya umbane kunye ne-cutter milling cutter.Kwakhona, sihlawula ingqalelo ephezulu ekulungiseni iiparamitha zokomba kunye nokuthintela i-burr ekuveliseni.
Isatifikethi
Inkcazo yeAluminiyam esekwe
Into | Uvavanyo a | AL-01-P Iinkcukacha | AL-01-A Inkcazo | AL-01-L Inkcazo | Iyunithi | |
I-Thermal Conductivity | A | 0.8±20% | 1.3±20% | 2.0±20% | 3.0±20% | W/mK |
Ukunyangwa kweThermal | 0.85 | 0.65 | 0.45 | 0.3 | ℃W | |
Ukumelana neSolder | 288deg.c | 120 | 120 | 120 | 120 | Isiqendu |
Amandla e-Peel Ubume obuqhelekileyo | I-Thermal | 1.2 | 1.2 | 1.2 | 1.2 | N/mm |
Ukuxhathisa umthamo Ubume obuqhelekileyo | C-96/35/90 E- | 108 | 108 | 108 | 108 | MΩ.CM |
Ukuxhathisa uMphezulu Ubume obuqhelekileyo | C-96/35/90 E- | 107 | 107 | 107 | 107 | MΩ |
Dielectric Constant | C-96/35/90 | 4.2 | 4.9 | 4.9 | 4.9 | 1MH2 |
I-Disipation Factor | C-96/35/90 | ≤0.02 | ≤0.02 | ≤0.02 | ≤0.02 | 1MH2 |
Ukufunxwa kwamanzi | 0.1 | 0.1 | 0.1 | 0.1 | % | |
Ukuqhekeka kweVolte | D-48/50+D-0.5/23 | 3 | 3 | 3 | 3 | KV/DC |
Amandla e-Insulation | A | 30 | 30 | 30 | 30 | KV/mm |
Phakamisa iCamber | A | 0.5 | 0.5 | 0.5 | 0.5 | % |
Ukutsha | UL94 | V-0 | V-0 | V-0 | V-0 | |
CTi | IEC60112 | 600 | 600 | 600 | 600 | V |
TG | 150 | 130 | 130 | 130 | ℃ |
Ukutyeba kweMveliso | Isikrini se-actinium singqindilili : 1 oz~15 oz, Ibhodi yealuminiyam ijiyile: |
Ukucaciswa kweMveliso | 1000×1200 500×1200(mm) |
• Ukufakwa kwesixhobo samaza elizwi, iamplifier yeoutput, compensating capacitor, voice frequency amplifier, preamplifier, i-amplifier yamandla njl.njl. • Izixhobo zobonelelo lombane: ulawulo lwamandla ombane, iswitsha yemodyuli, kunye ne-DC-AC transducer …njl. • Isixhobo sonxibelelwano nge-electron isandisi-lizwi esiphezulu, i-fiter ifowuni, thumela umnxeba wetelegram. • Ukuzenzekela kwe-Ofisi:umqhubi womshicileli,i-electronic display substrate enkulu kunye ne-thermal print A iklasi. • I-Autocar i-igniter, imodyuli yonikezelo lwamandla kunye nokutshintsha umatshini wokutshintsha, isilawuli sombane, ibe yinkqubo kuphela njl. • Ikhaltyhuleyitha.Ibhodi yeCPU, umqhubi wepani ethambileyo, kunye nesixhobo sokubonelela ngombane ... njl. • Ubunzima bokungunda kwamandla: ukutshintsha ukuhamba komatshini, ukuhanjiswa okuqinileyo, ibhulorho yabahambi njl.njl. • Ukukhanya kwe-LED, ukushisa kunye neendleko zamanzi: amandla amakhulu okukhanya kwe-LED, udonga lwe-LED njl |
FAQ
Ukuqinisekisa isicatshulwa esichanekileyo, qiniseka ukuba ubandakanya ulwazi olulandelayo lweprojekthi yakho:
l Gqibezela iifayile zeGERBER: kubandakanywa noluhlu lweBOM
l Ubungakanani: Khetha i-Num (pcs)
l Imilinganiselo: Ubude X Ububanzi mm
l Ixesha lokuvula: iintsuku zokusebenza
l IiMfuno zephaneli
l Iimfuno zeMathiriyeli
l Gqibezela iimfuno
Isicatshulwa sakho esiqhelekileyo siya kuhanjiswa kwiiyure nje ze-2-24, kuxhomekeke kubunzima boyilo.
Ihlolwe kwiiyure ezili-12.Nje ukuba umbuzo weNjineli kunye nefayile yokusebenza ihlolwe, siya kuqalisa imveliso.
Umthamo wemveliso yeemveliso ezithengiswayo ezishushu | |
Icala eliphindwe kabini/I-Multilayer PCB Workshop | I-Aluminiyam PCB Workshop |
UbuGcisa boBugcisa | UbuGcisa boBugcisa |
Imathiriyeli ekrwada: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Izinto ezibonakalayo: Isiseko seAluminiyam, isiseko sobhedu |
Umaleko: 1 umaleko ukuya kwi-20 Layers | Umaleko: 1 umaleko kunye neeLayers ezi-2 |
Min.line ububanzi/isithuba: 3mil/3mil(0.075mm/0.075mm) | Min.line ububanzi/isithuba: 4mil/4mil(0.1mm/0.1mm) |
Ubungakanani bomngxuma omncinci: 0.1mm(umngxuma wokuvala) | Min.Ubungakanani bomngxuma: 12mil(0.3mm) |
Max.Ubungakanani bebhodi: 1200mm * 600mm | Ubukhulu bebhodi: 1200mm* 560mm(47in* 22in) |
Ubukhulu bebhodi egqityiweyo: 0.2mm- 6.0mm | Ugqitywe ubukhulu bebhodi: 0.3 ~ 5mm |
Ubukhulu befoyile yobhedu: 18um~280um(0.5oz~8oz) | Ubukhulu befoyile yobhedu: 35um~210um(1oz~6oz) |
NPTH Ukunyamezela umngxuma: +/-0.075mm, PTH ukunyamezela umngxuma: +/-0.05mm | Ukunyamezela indawo yomngxuma: +/-0.05mm |
Ukunyamezelana kolwandlalo: +/-0.13mm | Ukunyamezela ulwandlalo lwendlela: +/ 0.15mm;ukunyamezela ulwandlalo lokubetha:+/ 0.1mm |
Umphezulu ugqityiwe: I-HASL engenalo isikhokelo, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP, ukufakwa kwegolide, umnwe wegolide, iCarbon INK. | Umphezulu ugqityiwe: Isikhokelo sasimahla seHASL, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP njl |
Ukunyamezela ukunyamezela: +/-10% | Hlala ukunyamezela ubunzima: +/-0.1mm |
Ikhono lokuvelisa: 50,000 sqm / ngenyanga | MC PCB Ukuvelisa amandla: 10,000 sqm / ngenyanga |
ISO9001, ISO14001,UL USA&USA Canada,IFA16949, SGS, RoHS ingxelo.
Siyalihlonipha ilungelo lobunikazi bomthengi kwaye soze senze i-PCB yomntu oneefayile zakho ngaphandle kokuba sifumana imvume ebhaliweyo evela kuwe, kwaye asizukwabelana ngeefayile nabanye abantu bangaphandle.
IiNkqubo zethu zokuqinisekisa uMgangatho zingezantsi:
a), uHlolo oluBonakalayo
b), iFlying probe, isixhobo sokulungisa
c), Ulawulo lokuphazamiseka
d), ukubonwa kobuchule bomthengisi
e), Imakroskopu yeDijithali ye-metallog
f), i-AOI (Uhlolo oluSebenzayo oluSebenzayo)
Amaxabiso ethu axhomekeke ekutshintsheni ngokuxhomekeke kubonelelo kunye neminye imiba yemarike.Siza kukuthumelela uluhlu lwamaxabiso oluhlaziyiweyo emva kokuba inkampani yakho ithumele umbuzo kuthi.
Nceda uthumele uphenyo lweenkcukacha kuthi, njengeNombolo yeNtengiso, ubungakanani bento nganye, isicelo soMgangatho, iLogo, iMimiselo yeNtlawulo, indlela yoThutho, indawo yokukhutshwa, njl njl. Siya kukwenzela i-quotation echanekileyo ngokukhawuleza.
Sinikezela ngempahla ngokuhambelana nemithetho ebekwe yinkampani ekhawulezayo, akusekho ntlawulo eyongezelelweyo.
Ngexesha lokuhanjiswa kwexesha lingaphezulu kwe-95%
a), iiyure ezingama-24 zijika ngokukhawuleza kwicala eliphindwe kabini leprototype PCB
b), iiyure ezingama-48 ze-4-8 umaleko weprototype PCB
c), iyure e-1 yekoteyishini
d), iiyure ezi-2 zombuzo wenjineli/ingxelo yesikhalazo
e), iiyure ze-7-24 zenkxaso yobugcisa / inkonzo ye-odolo / imisebenzi yokuvelisa