Icandelo lokuQala: Yintoni iAluminium PCB?
I-Aluminiyamu substrate luhlobo lwebhodi yesinyithi esekwe ngentsimbi enomsebenzi ogqwesileyo wokutshatyalaliswa kobushushu.Ngokuqhelekileyo, ibhodi enecala elilodwa yenziwe ngamacandelo amathathu: i-circuit layer (i-copper foil), i-insulating layer, kunye ne-metal base layer.Ukusetyenziswa komgangatho ophezulu, kukwakho noyilo olunamacala amabini kunye nesakhiwo somaleko wesekethe, i-insulating layer, isiseko se-aluminium, i-insulating layer, kunye ne-circuit layer.Inani elincinci lezicelo libandakanya iibhodi ezinoluhlu oluninzi, ezinokudalwa ngokudibanisa iibhodi eziqhelekileyo zoluhlu olunemigangatho ekhuselayo kunye neziseko ze-aluminium.
I-substrate ye-aluminium enecala elinye: Iquka umaleko omnye we-conductive pattern layer, insulating material, kunye ne-aluminium plate (substrate).
I-aluminium substrate enamacala amabini: Ibandakanya iileya ezimbini zeepateni zokuqhuba, izinto zokugquma, kunye nepleyiti ye-aluminium (i-substrate) ehlanganiswe kunye.
Multi- umaleko eprintiweyo ibhodi yesekethe aluminiyam: Yinto ibhodi yesekethe eprintiweyo eyenziwe laminating kunye bonding ezintathu okanye ngaphezulu umaleko iphethini conductive umaleko, insulating impahla, kunye nepleyiti aluminiyam (substrate) kunye.
Yahlulwe ngeendlela zonyango ezingaphezulu:
Ibhodi etyatyekwe ngegolide (Igolide ecekethekileyo yeChemical, iChemical eshinyeneyo yegolide, ekhethiweyo yegolide yokubeka)
Icandelo lesiBini: Umgaqo wokuSebenza we-Aluminiyam Substrate
Izixhobo zamandla zixhonywe phezulu kwinqanaba lesekethe.Ubushushu obuveliswa zizixhobo ngexesha lokusebenza luqhutywa ngokukhawuleza ngoluhlu lwe-insulating ukuya kuluhlu lwesiseko sesinyithi, oluthi ke luchithe ubushushu, lufezekise ukutshabalalisa ubushushu bezixhobo.
Xa kuthelekiswa ne-FR-4 yendabuko, i-aluminium substrates inokunciphisa ukuxhathisa kwe-thermal, ibenze abaqhubi ababalaseleyo bobushushu.Xa kuthelekiswa neesekethe ze-ceramic ezishinyeneyo, zikwanazo iipropathi zoomatshini eziphezulu.
Ukongeza, ii-aluminiyam substrates zineenzuzo ezilandelayo:
- Ukuthotyelwa kweemfuno ze-RoHs
- Ukuziqhelanisa ngcono neenkqubo ze-SMT
-Ukuphatha ngokufanelekileyo ukusasazwa kwe-thermal kuyilo lwesekethe ukunciphisa ubushushu bokusebenza kwemodyuli, ukwandisa ixesha lokuphila, ukwandisa ukuxinana kwamandla kunye nokuthembeka.
- Ukunciphisa indibano yeesinki zobushushu kunye nezinye izixhobo ezibandakanya i-thermal interface, okukhokelela kumthamo omncinci wemveliso kunye ne-hardware ephantsi kunye neendleko zendibano, kunye nokudityaniswa okufanelekileyo kwamandla kunye neesekethe zokulawula.
- Ukutshintshwa kwee substrates zeceramic eziethe-ethe ukuze kuphuculwe ukuqina koomatshini
Icandelo lesithathu: Ukuqulunqwa kweeSubstrates zeAluminiyam
1. Umaleko weSekethe
Uluhlu lwesiphaluka (ngokuqhelekileyo usebenzisa i-copper ye-electrolytic foil) igxininiswe ukwenza iisekethe eziprintiweyo, ezisetyenziselwa ukudibanisa icandelo kunye nokudibanisa.Xa kuthelekiswa ne-FR-4 yendabuko, kunye nobukhulu obufanayo kunye nobubanzi bomgca, i-aluminium substrates inokuthwala imisinga ephezulu.
2. I-Insulating Layer
Umaleko we-insulating yitekhnoloji ephambili kwi-aluminium substrates, esebenza ngokuyintloko ukunamathela, ukugquma, kunye nokuqhuba ubushushu.Umaleko wokugquma we-aluminium substrates ngowona mqobo ubalulekileyo we-thermal kwizakhiwo zemodyuli yamandla.I-conductivity engcono ye-thermal ye-insulating layer iququzelela ukusasazwa kobushushu obuveliswa ngexesha lokusebenza kwesixhobo, okukhokelela kubushushu obuphantsi bokusebenza, ukunyuka kwamandla emodyuli, ubungakanani obuncitshisiweyo, ixesha elide lokuphila, kunye nokuphuma kwamandla aphezulu.
3. I-Metal Base Layer
Ukukhethwa kwesinyithi kwisiseko setsimbi se-insulating kuxhomekeke kwingqwalasela ebanzi yezinto ezifana ne-coefficient yesiseko sesinyithi sokwandiswa kwe-thermal, i-thermal conductivity, amandla, ukuqina, ubunzima, imeko yomhlaba kunye neendleko.
Icandelo leSine: Izizathu zokuKhetha iAluminiyam Substrates
1. Ukutshatyalaliswa kobushushu
Iibhodi ezininzi ezinamacala amabini kunye ne-multi-layer zine-high density kunye namandla, okwenza ukutshatyalaliswa kobushushu kube ngumngeni.Izinto eziqhelekileyo ze-substrate ezifana ne-FR4 kunye ne-CEM3 zi-conductor ezimbi zokushisa kwaye zine-inter-layer insulation, ekhokelela ekulahlekeni kobushushu obunganelanga.Iisubstrates zeAluminiyam ziwusombulula lo mba wokuphelisa ubushushu.
2. Ukwandiswa kweThermal
Ukwandiswa kwe-thermal kunye nokunciphisa kuhambelana nezinto eziphathekayo, kwaye izinto ezahlukeneyo zinee-coefficients ezahlukeneyo zokwandiswa kwe-thermal.Iibhodi eziprintiweyo ze-aluminium ezisekelwe ngokufanelekileyo zijongana kakuhle nemiba yokutshatyalaliswa kobushushu, ukunciphisa ingxaki yezinto ezahlukeneyo zokwandiswa kwe-thermal kumacandelo ebhodi, ukuphucula ukuqina okupheleleyo kunye nokuthembeka, ngakumbi kwi-SMT (i-Surface Mount Technology) izicelo.
3. Uzinzo lweDimensional
Iibhodi eziprintiweyo ezisekelwe kwi-Aluminiyam zizinzile ngakumbi ngokwemilinganiselo yobukhulu xa kuthelekiswa neebhodi eziprintiweyo ze-insulated.Ukutshintsha kwe-dimensional yeebhodi eziprintiweyo ezisekelwe kwi-aluminium okanye iibhodi eziphambili ze-aluminium, ezifudumala ukusuka kwi-30 ° C ukuya kwi-140-150 ° C, yi-2.5-3.0%.
4. Ezinye Izizathu
Iibhodi eziprintiweyo ezisekelwe kwi-aluminiyam zineempembelelo zokukhusela, zibuyisela i-substrates ze-ceramic ezinqabileyo, zifanelekile kwithekhnoloji yokunyuka komphezulu, ukunciphisa indawo esebenzayo yeebhodi eziprintiweyo, ukubuyisela amacandelo afana neendawo zokutshisa ukushisa ukunyusa ukuxhathisa ukushisa kwemveliso kunye neempawu ezibonakalayo, kunye nokunciphisa iindleko zemveliso kunye nomsebenzi.
Icandelo lesihlanu: Ukusetyenziswa kweAluminiyam Substrates
1. Izixhobo zomsindo: Iinput/output amplifiers, amplifiers balanced, audio amplifiers, pre-amplifiers, power amplifiers, njl.
2. Izixhobo zamandla: Ukutshintsha abalawuli, abaguquleli be-DC / AC, abalungisi be-SW, njl.
3. Unxibelelwano Izixhobo ze-Electronic: I-high-frequency amplifiers, izixhobo zokucoca, iisekethe zokuhambisa, njl.
4. I-Ofisi ye-Automation Equipment: Abaqhubi beemoto zombane, njl.
5. Iimoto: Abalawuli be-elektroniki, iinkqubo zokutshisa, abalawuli bamandla, njl.
6. Iikhompyutha: Iibhodi ze-CPU, ii-floppy disk drives, iiyunithi zamandla, njl.
7. Iimodyuli zamandla: Ii-inverters, i-slid-state relays, iibhuloho zokulungisa, njl.
8. Izibane zokukhanyisa: Ngokukhuthazwa kwezibane zokugcina amandla, i-aluminium-based substrates isetyenziswa ngokubanzi kwizibane ze-LED.
Ixesha lokuposa: Aug-09-2023
