Umphezulu ogqityiweyo wePCB (iBhodi yeSekethe eShicileleyo) ibhekisa kuhlobo lokwaleka okanye unyango olusetyenziswa kwimikhondo yobhedu evelileyo kunye neepads kumphezulu webhodi.Ukugqitywa komphezulu kusebenzela iinjongo ezininzi, kubandakanywa nokukhusela ubhedu oluveziweyo kwi-oxidation, ukuphucula ukuthengiseka, kunye nokubonelela ngomphezulu othe tyaba wokuncamathiselwa kwecandelo ngexesha lokudityaniswa.Ukugqitywa komphezulu okwahlukileyo kunika amanqanaba ahlukeneyo okusebenza, ixabiso, kunye nokuhambelana nezicelo ezithile.
Ukufakwa kwegolide kunye nokuntywiliselwa kwegolide ziinkqubo ezisetyenziswa ngokuqhelekileyo kwimveliso yebhodi yesekethe yanamhlanje.Ngokuhlanganiswa okunyukayo kwee-ICs kunye nenani elikhulayo lezikhonkwane, inkqubo yokutshiza i-solder vertical ilwela ukubethelela iipads ezincinci ze-solder, ibeka imingeni kwindibano ye-SMT.Ukongezelela, ubomi beshelufu yeepleyiti ze-tin ezitshiziweyo bufutshane.Iinkqubo zegolide zokucwenga okanye ukuntywiliselwa kwegolide zibonelela ngezisombululo kule miba.
Kwitekhnoloji yokunyusa umphezulu, ngakumbi kumacandelo amancinci kakhulu afana ne-0603 kunye ne-0402, ukucaba kweepadi ze-solder kuchaphazela ngqo umgangatho woshicilelo lwe-solder paste, ethi yona ibe nefuthe elibonakalayo kumgangatho wokuphinda kufakwe i-solder.Ke ngoko, ukusetyenziswa kwebhodi egcweleyo yegolide-iplating okanye igolide yokuntywiliselwa ihlala ibonwa kuxinaniso oluphezulu kunye neenkqubo zokunyuka komphezulu ezincinci.
Ngexesha lesigaba semveliso yolingo, ngenxa yezinto ezifana nokuthengwa kwecandelo, iibhodi zihlala zingathengiswa ngokukhawuleza xa zifika.Kunoko, zisenokulinda iiveki okanye iinyanga ngaphambi kokuba zisetyenziswe.Ubomi beshelufu yeebhodi zegolide ezifakwe kwigolide kunye nokuntywiliselwa ixesha elide kuneebhodi ezifakwe kwi-tin.Ngenxa yoko, ezi nkqubo ziyakhethwa.Iindleko zeePCB ezityalwe ngegolide kunye nokuntywiliselwa kwegolide ngexesha lesampulu zithelekiseka naleyo yeebhodi zealloy tin.
1. I-Electroless Nickel Immersion Gold (ENIG): Le yindlela eqhelekileyo yonyango ye-PCB yomphezulu.Kubandakanya ukusebenzisa umaleko we-nickel engena-electro njengomaleko ophakathi kwi-solder pads, ulandelwa ngumaleko wegolide entywiliselwayo kumphezulu we-nickel.I-ENIG ibonelela ngeengenelo ezinje ngokuthengiswa kakuhle, ukuthamba, ukuxhathisa umhlwa, kunye nokusebenza kakuhle kokuthengisela.Iimpawu zegolide zikwanceda ekukhuseleni i-oxidation, ngaloo ndlela iphucula ukuzinza kwexesha elide.
2. I-Hot Air Solder Leveling (HASL): Le yenye indlela yonyango eqhelekileyo yomphezulu.Kwinkqubo ye-HASL, iipads ze-solder zifakwe kwi-alloy tin etyhidiweyo kwaye i-solder engaphezulu ivuthwe kusetyenziswa umoya oshushu, ishiya ngasemva i-solder layer.Uncedo lwe-HASL lubandakanya iindleko eziphantsi, ukulula kokwenziwa kunye nokuthengiswa, nangona ukuchaneka komphezulu kunye nokuthambeka kusenokuba ngaphantsi xa kuthelekiswa.
3. Electroplating Gold: Le ndlela ibandakanya electroplating umaleko wegolide kwi pads solder.Igolide igqwesa ekuqhubeni umbane kunye nokuchasana nokubola, ngaloo ndlela iphucula umgangatho we-soldering.Nangona kunjalo, ukucwenga kwegolide kubiza kakhulu xa kuthelekiswa nezinye iindlela.Isetyenziswa ngakumbi kwiminwe yegolide.
4. I-Organic Solderability Preservatives (OSP): I-OSP ibandakanya ukusebenzisa umaleko okhuselayo wezinto eziphilayo kwiipads ze-solder ukuze zikhuseleke kwi-oxidation.I-OSP ibonelela ngokutyabeka okuhle, ukuthengiseka, kwaye ifanelekile kwizicelo zomsebenzi wokukhanya.
5. Itoti yokuntywiliselwa: Ngokufanayo negolide yokuntywiliselwa, inkonkxa yokuntywiliselwa ibandakanya ukugquma iipadi zesolder ngomaleko wetoti.Itoti yokuntywiliselwa ibonelela ngokusebenza kakuhle kwe-soldering kwaye inexabiso eliphantsi xa kuthelekiswa nezinye iindlela.Nangona kunjalo, isenokungagqwesi kakhulu njengegolide yokuntywiliselwa ngokwemigaqo yokumelana nomhlwa kunye nokuzinza kwexesha elide.
6. I-Nickel / i-Gold Plating: Le ndlela ifana nokucwiliswa kwegolide, kodwa emva kokufakwa kwe-nickel e-electroless, umaleko wobhedu ugqunywe kulandelwa unyango lwe-metalization.Le ndlela inikezela nge-conductivity efanelekileyo kunye nokumelana nokubola, okufanelekileyo kwizicelo eziphezulu zokusebenza.
7. I-Silver Plating: I-Silver plating ibandakanya ukugquma iipads ze-solder kunye nomaleko wesilivere.Isilivere igqwesile ngokwemigaqo yokuqhuba, kodwa inokukhuselwa xa ivezwe emoyeni, ihlala ifuna umaleko owongezelelweyo okhuselayo.
8. I-Hard Gold Plating: Le ndlela isetyenziselwa izixhumi okanye iindawo zoqhagamshelwano zesokhethi ezifuna ukufakwa rhoqo kunye nokususwa.Umaleko otyebileyo wegolide usetyenziswa ukubonelela ukuxhathisa ukunxiba kunye nokusebenza kokubola.
Umahluko phakathi koKutyalwa kweGolide kunye nokuNyekiswa kweGolide:
1. Ulwakhiwo lwekristale olwenziwe ngegolide-iplating kunye negolide yokuntywiliselwa yahlukile.Ukucwenga kwegolide kunomaleko wegolide obhityileyo xa kuthelekiswa nokuntywiliselwa kwegolide.Ukucwenga kwegolide kuthanda ukuba tyheli ngakumbi kunegolide entywiliselwayo, leyo abathengi bayifumanisa yanelisa ngakumbi.
2. Igolide yokuntywiliselwa ineempawu ezingcono zokuthengisela xa kuthelekiswa negolide-yokucwenga, ukunciphisa iziphene ze-soldering kunye nezikhalazo zabathengi.Iibhodi zegolide zokucwiliswa zinoxinzelelo olulawulekayo kwaye zifaneleke ngakumbi kwiinkqubo zokudibanisa.Nangona kunjalo, ngenxa yendalo yayo ethambileyo, igolide yokuntywiliselwa ayihlali ixesha elide kwiminwe yegolide.
3. Igolide yokuntywiliselwa kuphela idyasa i-nickel-gold kwi-solder pads, ayichaphazeli ukuhanjiswa komqondiso kumaleko obhedu, ngelixa ukucwenga kwegolide kunokuba nempembelelo yokuhanjiswa komqondiso.
4. I-hard Gold plating inokwakheka kwekristale exineneyo xa kuthelekiswa negolide entywiliselwayo, nto leyo eyenza ukuba ichaphazeleke kancinci kwi-oxidation.Igolide entywiliselwayo inomaleko wegolide obhityileyo, onokuthi uvumele i-nickel ukuba isasazeke ngaphandle.
5. Igolide yokuntywiliselwa ayinakwenzeka ukuba ibangele iisekethe ezimfutshane zocingo kuyilo olunoxinaniso oluphezulu xa kuthelekiswa nokufakwa kwegolide.
6. Igolide yokuntywiliselwa inomatheliso olungcono phakathi kwe-solder resist and copper layers, engachaphazeli izithuba ngexesha leenkqubo zembuyekezo.
7. Igolide yokuntywiliselwa isoloko isetyenziselwa iibhodi ezinemfuno ephezulu ngenxa yokucaba kwayo okungcono.I-Gold-plating ngokubanzi igwema i-post-assembly phenomenon ye-pad emnyama.Umcaba kunye nobomi beshelufu yeebhodi zegolide ezintywiliselwayo zilungile njengezo zegolide zokwaleka.
Ukukhetha indlela efanelekileyo yonyango lomphezulu kufuna ukuba kuthathelwe ingqalelo izinto ezifana nokusebenza kombane, ukunganyangeki komhlwa, iindleko, kunye neemfuno zokusetyenziswa.Ngokuxhomekeke kwiimeko ezithile, iinkqubo ezifanelekileyo zonyango lomphezulu zingakhethwa ukuhlangabezana neendlela zokuyila.
Ixesha lokuposa: Aug-18-2023
