Ukuvula iSuphu yeAlfabhethi: 60 Kufuneka-Uzazi izifinyezo kuShishino lwePCB

Ishishini lePCB (iBhodi yeSekethe eShicileleyo) licandelo letekhnoloji ephucukileyo, ukuveliswa kwezinto ezintsha, kunye nobunjineli obuchanekileyo.Nangona kunjalo, ikwaza nolwimi lwayo olulodwa oluzaliswe zizifinyezo ezifihlakeleyo kunye nee-acronyms.Ukuqonda ezi zishunqulelo zeshishini lePCB kubalulekile kuye nabani na osebenza endle, ukusuka kwiinjineli kunye nabayili ukuya kubavelisi kunye nababoneleli.Kwesi sikhokelo sibanzi, siza kucacisa ii-60 zezifinyezo ezibalulekileyo ezidla ngokusetyenziswa kushishino lwePCB, zikhanyise ngeentsingiselo ezisemva koonobumba.

**1.I-PCB – IBhodi yeSekethe eShicileleyo**:

Isiseko sezixhobo zombane, ukubonelela ngeqonga lokunyuka kunye nokudibanisa amacandelo.

**2.I-SMT – iTekhnoloji yoMphezulu weMount**:

Indlela yokuncamathelisa amacandelo e-elektroniki ngokuthe ngqo kumphezulu we-PCB.

**3.I-DFM – Uyilo lokuVeliswa**:

Izikhokelo zokuyila ii-PCBs ngokulula ukuvelisa engqondweni.

**4.DFT – Uyilo loVavanyo**:

Yila imigaqo yovavanyo olusebenzayo kunye nokufumanisa iimpazamo.

**5.I-EDA – Uyilo oluzenzekelayo**:

Izixhobo zesoftware yoyilo lwesekethe yombane kunye noyilo lwePCB.

**6.I-BOM – IBhili yeziMathiriyeli**:

Uluhlu olubanzi lwamacandelo kunye nezinto ezifunekayo kwindibano yePCB.

**7.I-SMD-Isixhobo sokuNyusa uMphezulu**:

Amacandelo enzelwe indibano ye-SMT, enesikhokelo esisicaba okanye iipads.

**8.PWB – IBhodi yeeNcingo eziShicileleyo**:

Igama ngamanye amaxesha lisetyenziswa ngokutshintshanayo kunye ne-PCB, ngokwesiqhelo kwiibhodi ezilula.

**9.I-FPC-ISekethe eShicileleyo eFlexible**:

IiPCB ezenziwe ngezinto eziguquguqukayo zokugoba kwaye zihambelane nemigangatho engacwangciswanga.

**10.I-Rigid-Flex PCB**:

PCBs ezidibanisa izinto engqongqo kunye bhetyebhetye kwibhodi enye.

**11.I-PTH-Icandelwe ngomngxuma**:

Imingxunya kwii-PCB ezine-conductive plating ye-solder yecandelo lomngxuma.

**12.NC – Ulawulo lwamanani**:

Imveliso elawulwa yiKhompyutha yokwenziwa kwePCB echanekileyo.

**13.I-CAM – Ukwenziwa koNcedo lweKhompyutha**:

Izixhobo zeSoftware ukuvelisa idatha yokwenziwa kwemveliso yePCB.

**14.I-EMI – Uphazamiseko loMbane**:

imitha ye-electromagnetic engafunekiyo enokuphazamisa izixhobo zombane.

**15.I-NRE – Ubunjineli obuNgaphindiyo**:

Iindleko zexesha elinye zophuhliso loyilo lwePCB, kubandakanya nemirhumo yokuseta.

**16.UL – IiLebhu zaBanzi**:

Iqinisekisa ii-PCBs ukuhlangabezana nemigangatho ethile yokhuseleko kunye nokusebenza.

**17.I-RoHS-Unyino lwezinto ezinobungozi**:

Umyalelo olawula ukusetyenziswa kwezinto ezinobungozi kwiiPCBs.

**18.IPC – Iziko loQhagamshelwano kunye nokuPakisha iiSekethe zoMbane**:

Useka imigangatho yoshishino yoyilo lwePCB kunye nokuveliswa.

**19.I-AOI-UHlolo oluSebenzayo lwaMacho**:

Ulawulo lomgangatho usebenzisa iikhamera ukuhlola ii-PCB ngeziphene.

**20.I-BGA – Uluhlu lweGridi yeBhola**:

Iphakheji ye-SMD eneebhola ze-solder kwi-underside yoqhagamshelwano oluphezulu.

**21.CTE – Coefficient of thermal Expansion**:

Umlinganiselo wendlela izinto ezanda ngayo okanye isivumelwano kunye nokutshintsha kobushushu.

**22.OSP – Organic Solderability Preservative**:

Umaleko obhityileyo owenziweyo ukukhusela imikhondo yobhedu evelileyo.

**23.I-DRC – Jonga uMthetho woYilo**:

Iitshekhi ezizenzekelayo zokuqinisekisa ukuba uyilo lwePCB luyahlangabezana neemfuno zemveliso.

**24.I-VIA – UFikelelo loNxibelelwano oluthe nkqo**:

Imingxunya esetyenziselwa ukudibanisa iileya ezahlukeneyo zePCB ye-multilayer.

**25.I-DIP – Ipakethe eNxibele kabini eLayini**:

Ilungu lomngxuma elinemiqolo emibini enxuseneyo yelothe.

**26.I-DDR – Ireyithi yedatha ephindwe kabini**:

Itekhnoloji yememori ehambisa idatha kuzo zombini iincam ezinyukayo neziwayo zesiginali yewotshi.

**27.I-CAD – Uyilo oluNceda kwiKhompyutha**:

Izixhobo zesoftware yoyilo lwePCB kunye noyilo.

**28.I-LED-I-Diode yokuKhanya yokuKhanya**:

Isixhobo se-semiconductor esikhupha ukukhanya xa umsinga wombane udlula kuso.

**29.I-MCU – iYunithi yesilawuli seMicro**:

Isekethe edibeneyo edibeneyo equlethe iprosesa, imemori, kunye neeperipherals.

**30.ESD – Electrostatic Discharge**:

Ukuhamba kombane ngokukhawuleza phakathi kwezinto ezimbini ezineentlawulo ezahlukeneyo.

**31.I-PPE-Isixhobo soKhuseleko lomntu**:

Izixhobo zokhuseleko ezifana neeglavu, iiglasi, kunye neesuti ezinxitywa ngabasebenzi bokwenza iPCB.

**32.QA – UQinisekiso loMgangatho**:

Iinkqubo kunye nezenzo zokuqinisekisa umgangatho wemveliso.

**33.I-CAD/CAM – Uyilo oluNceda kwiKhompyutha/Uveliso oluNceda kwiKhompyutha**:

Ukudityaniswa koyilo kunye neenkqubo zokuvelisa.

**34.I-LGA-Land Grid Array**:

Ipakethe enoluhlu lweepads kodwa akukho zikhokelo.

**35.I-SMTA-uMbutho weTekhnoloji yoMphezulu weMount**:

Umbutho ozinikele ekuqhubeleni phambili ulwazi lwe-SMT.

**36.I-HASL-INqanaba leSoda yoMoya eshushu**:

Inkqubo yokufaka ukutyabeka kwi-solder kwimiphezulu ye-PCB.

**37.I-ESL-Equivalent Series Inductance**:

Ipharamitha emele i-inductance kwi-capacitor.

**38.ESR – Equivalent Series Resistance**:

Ipharamitha emele ilahleko ezichasayo kwi-capacitor.

**39.I-THT-Itekhnoloji yomngxunya womngxuma**:

Indlela yokunyuswa kwezixhobo ezinezikhokelo ezidlula kwimingxuma kwiPCB.

**40.I-OSP – Ixesha Elingaphandle KweNkonzo**:

Ixesha iPCB okanye isixhobo singasebenzi.

**41.RF – Irediyo Frequency**:

Iimpawu okanye amacandelo asebenza kwiifrikhwensi eziphezulu.

**42.DSP – Digital Signal Prosesa**:

I-microprocessor ekhethekileyo eyenzelwe imisebenzi yokucwangcisa umqondiso wedijithali.

**43.I-CAD-Isixhobo sokuqhotyoshela iCandelo**:

Umatshini osetyenziselwa ukubeka amacandelo e-SMT kwiiPCBs.

** 44.I-QFP-I-Quad Flat Package**:

Iphakheji ye-SMD enamacala amane acaba kwaye ikhokelela kwicala ngalinye.

** 45.I-NFC – Unxibelelwano olukufuphi noMmandla**:

Itekhnoloji yonxibelelwano olufutshane olungenazingcingo.

** 46.I-RFQ-Isicelo seQuote**:

Uxwebhu olucela amaxabiso kunye nemigaqo kumvelisi wePCB.

**47.I-EDA – Uyilo oluzenzekelayo**:

Igama ngamanye amaxesha lisetyenziswa ukubhekisa kuyo yonke isuti yoyilo lwesoftware yePCB.

** 48.I-CEM – uMvelisi woMbane weKhontrakthi**:

Inkampani egxile kwindibano yePCB kunye neenkonzo zokuvelisa.

** 49.I-EMI/RFI – Uphazamiseko lwe-Electromagnetic/I-Radio-Frequency Interference**:

imitha ye-electromagnetic engafunekiyo enokuphazamisa izixhobo zombane kunye nonxibelelwano.

**50.RMA-Buyisela uGunyaziso lweMpahla**:

Inkqubo yokubuyisela kunye nokutshintsha amacandelo e-PCB anesiphene.

**51.UV-Uultraviolet**:

Uhlobo lokusasazeka kwemitha esetyenziswa kwi-PCB yokunyanga kunye ne-PCB solder mask processing.

**52.I-PPE-Injineli yeParamitha yeNkqubo**:

Ingcali elungiselela iinkqubo zokuvelisa i-PCB.

**53.TDR – Ixesha leDomain Reflectometry**:

Isixhobo sokuxilonga ukulinganisa iimpawu zomgca wothumelo kwii-PCB.

**54.ESR – Electrostatic Resistivity**:

Umlinganiselo wesakhono sesixhobo sokuchitha umbane ongatshintshiyo.

**55.I-HASL - iNqanaba leSoda yoMoya eNxweme**:

Indlela yokusebenzisa ukutyabeka kwi-solder kwi-PCB.

**56.IPC-A-610**:

Umgangatho woshishino wendlela yokwamkelwa kwendibano yePCB.

**57.BOM – Ulwakhiwo lweMathiriyeli**:

Uluhlu lwezixhobo kunye namacandelo afunekayo kwindibano yePCB.

**58.I-RFQ-Isicelo seNtelekelelo yamaxabiso**:

Uxwebhu olusesikweni olucela iikowuti kubaboneleli bePCB.

**59.HAL – iNqanaba loMoya oshushu**:

Inkqubo yokuphucula i-solderability yemigangatho yobhedu kwi-PCBs.

**60.I-ROI – Buyela kuTyalo-mali**:

Umlinganiselo wenzuzo yeenkqubo zokwenziwa kwePCB.

Ngoku ukuba uvule ikhowudi emva kwezi zishunqulelo zibalulekileyo ezingama-60 kushishino lwe-PCB, uxhotyiswe ngcono ukuhamba kule ndawo inzima.Nokuba unamava obuchule okanye usaqala uhambo lwakho kuyilo lwePCB kunye nokuveliswa, ukuqonda ezi akhronimi ngundoqo kunxibelelwano olusebenzayo kunye nempumelelo kwihlabathi leeBhodi zeSekethi eziShicileleyo.Ezi zishunqulelo zilulwimi lwentsha