Kwinkqubo yePCBimveliso, ukuveliswa kweIstencil yentsimbi (ekwabizwa ngokuba yi "stencil")yenziwa ngokuchanekileyo ukufaka i-solder paste kwi-solder palale umaleko we-PCB.I-solder paste layer, ekwabizwa ngokuba yi "Cola imaski umaleko," yinxalenye yefayile yoyilo yePCB esetyenziselwa ukuchaza izikhundla kunye neemilo zePCB.i-solder paste.Olu luhlu lubonakala phambi kweItekhnoloji yokunyuka komphezulu (SMT)izixhobo zithengiswa kwi-PCB, ebonisa apho i-solder paste ifuna ukubekwa khona.Ngexesha lenkqubo ye-soldering, i-stencil yensimbi igubungela i-solder paste layer, kunye ne-solder paste isetyenziswe ngokuchanekileyo kwi-PCB pads ngokusebenzisa imingxuma kwi-stencil, iqinisekisa i-solder echanekileyo ngexesha lenkqubo yokuhlanganisa icandelo elilandelayo.
Ngoko ke, i-solder paste layer yinto ebalulekileyo ekuveliseni i-stencil yensimbi.Kwinqanaba lokuqala lokwenziwa kwe-PCB, ulwazi malunga ne-solder paste layer ithunyelwa kumenzi we-PCB, ovelisa i-stencil yentsimbi ehambelanayo ukuqinisekisa ukuchaneka kunye nokuthembeka kwenkqubo yokuthengisa.
Kuyilo lwePCB (iBhodi yeSekethe eShicileleyo), "ipastemask" (ekwabizwa ngokuba yi "solder paste mask" okanye ngokulula "solder mask") ngumaleko obalulekileyo.Idlala indima ebalulekileyo kwinkqubo ye-soldering yokudibanisaizixhobo zokukhwela umphezulu (SMDs).
Umsebenzi we-stencil yensimbi kukuthintela i-solder paste ukuba isetyenziswe kwiindawo apho i-soldering akufanele yenzeke xa i-soldering components SMD.I-Solder i-paste yinto esetyenziselwa ukudibanisa amacandelo e-SMD kwi-pads ye-PCB, kwaye i-pastemask layer isebenza "njengesithintelo" sokuqinisekisa ukuba i-solder paste isetyenziswe kuphela kwiindawo ezithile ze-soldering.
Uyilo loluhlu lwe-pastemask lubaluleke kakhulu kwinkqubo yokwenziwa kwe-PCB njengoko ichaphazela ngokuthe ngqo umgangatho wokuthengisa kunye nokusebenza ngokubanzi kwamacandelo e-SMD.Ngexesha loyilo lwe-PCB, abaqulunqi kufuneka baqwalasele ngononophelo ukucwangciswa kwe-pastemask layer, ukuqinisekisa ukulungelelaniswa kwayo kunye nezinye iileyile, ezifana ne-pad layer kunye necandelo lecandelo, ukuqinisekisa ukuchaneka kunye nokuthembeka kwenkqubo ye-soldering.
IiNgcaciso zoYilo loMaleko weMaski yeSolder (iStencil sentsimbi) kwiPCB:
Kuyilo lwe-PCB kunye nokuveliswa, iinkcukacha zenkqubo ye-Solder Mask Layer (eyaziwa ngokuba yi-Steel Stencil) ichazwa ngokuqhelekileyo ngemigangatho yoshishino kunye neemfuno zomenzi.Nazi ezinye iinkcukacha zoyilo eziqhelekileyo zeSolder Mask Layer:
1. IPC-SM-840C: Lo ngumgangatho weSolder Mask Layer esekwe yi-IPC (Association Connecting Electronics Industries).Umgangatho uchaza ukusebenza, iimpawu zomzimba, ukuqina, ubukhulu, kunye neemfuno zokuthengiswa kwemaski ye-solder.
2. Umbala kunye noHlobo: Imaski ye-solder inokuza kwiintlobo ezahlukeneyo, ezifanaUmgangatho weSoda yoMoya oshushu (HASL) or I-Electroless Nickel Immersion Gold(ENIG), kunye neentlobo ezahlukeneyo zinokuba neemfuneko ezicacileyo ezahlukeneyo.
3. Ukugubungela i-Solder Mask Layer: I-solder mask layer kufuneka igubungele zonke iindawo ezifuna i-solder of components, ngelixa uqinisekisa ukukhuselwa okufanelekileyo kweendawo ekungafuneki zithengiswe.Umaleko wemaski we-solder kufuneka uthintele ukugquma iindawo zokuxhoma okanye iimpawu zesikrini sesilika.
4. Ukucaca kwe-Solder Mask layer: I-solder mask layer kufuneka icace kakuhle ukuqinisekisa ukubonakala okucacileyo kwemiphetho ye-solder pads kunye nokukhusela i-solder paste ekuphuphumeni kwiindawo ezingafunekiyo.
5. Ukutyeba koMaleko weMaski yeSolder: Ubukhulu bomaleko wemaski ye-solder kufuneka buhambelane neemfuno eziqhelekileyo, ngokuqhelekileyo phakathi koluhlu lwamashumi aliqela eemicrometers.
6. Ukuthintelwa kwe-Pin: Amanye amalungu okanye izikhonkwane ezikhethekileyo zinokufuna ukuhlala eveziwe kumaleko we-solder mask ukuhlangabezana neemfuno ezithile zokutywina.Kwiimeko ezinjalo, iinkcukacha zeemaski ze-solder zingafuna ukuphepha ukusetyenziswa kwe-mask ye-solder kwezo ndawo zikhethekileyo.
Ukuthobela ezi nkcukacha kubalulekile ukuqinisekisa umgangatho kunye nokuchaneka kwe-solder mask layer, ngaloo ndlela kuphuculwe izinga lokuphumelela kunye nokuthembeka kokuveliswa kwe-PCB.Ukongeza, ukuthotyelwa kwezi nkcukacha kunceda ukwandisa ukusebenza kwe-PCB kunye nokuqinisekisa ukudibanisa okuchanekileyo kunye nokuthengiswa kwezinto ze-SMD.Ukusebenzisana nomenzi kunye nokulandela imigangatho efanelekileyo ngexesha lenkqubo yokuyila kuyinyathelo elibalulekileyo ekuqinisekiseni umgangatho we-stencil layer yensimbi.
Ixesha lokuposa: Aug-04-2023
