Network Access Control PCB ibhodi Controller PCBA Board for Telecommunication Industry
Ulwazi lokwenziwa kwemveliso
| Umzekelo No. | PCB-A44 |
| Indlela yeNdibano | SMT |
| Iphakheji yezothutho | Ukupakishwa kwe-Anti-static |
| Isiqinisekiso | UL, ISO9001&14001, SGS, RoHS, Ts16949 |
| Iingcaciso | IPC Udidi 2 |
| Ubuncinane besithuba/umgca | 0.075mm/3mil |
| Isicelo | Unxibelelwano |
| Imvelaphi | Yenziwe etshayina |
| Isakhono seMveliso | 720,000 M2/Ngonyaka |
Ingcaciso yeMveliso
PCBA Projects Intshayelelo
I-ABIS CIRCUITS Inkampani ihambisa iinkonzo, hayi iimveliso kuphela.Sinikezela ngezisombululo, hayi iimpahla kuphela.
Ukusuka kwimveliso yePCB, amacandelo athengwayo ukuya kumacandelo ayahlangana.Iquka:
- PCB Custom
- Umzobo wePCB / uyilo ngokomzobo wakho weskim
- Ukwenziwa kwePCB
- Ukufumana icandelo
- PCB Hlanganisa
- PCBA 100% uvavanyo
Izinto Eziluncedo Zethu
- Isiphelo esiphezulu se-euipment-high speed Pick and Place Machines ezinokusetyenzwa malunga nama-25,000 amacandelo e-SMD ngeyure.
- Ikhono eliphezulu lokubonelela nge-60K Sqm ngenyanga-Ibonelela ngevolumu ephantsi kunye nemveliso yePCB efunekayo, kunye nemveliso enkulu.
- Iqela lobunjineli bobuchwephesha-iinjineli ezingama-40 kunye nendlu yazo yezixhobo, eyomeleleyo kwi-OEM.Inika iinketho ezimbini ezilula: Ulwazi oluqhelekileyo kunye nomgangatho onzulu we-IPC Class Class II kunye ne-III
Sinikezela ngenkonzo ebanzi yokujika i-EMS kubathengi abafuna ukuba sihlanganise i-PCB kwi-PCBA, kubandakanywa neeprototypes, iprojekthi ye-NPI, umthamo omncinci kunye nophakathi.Kwakhona siyakwazi ukukhangela onke amacandelo kwiprojekthi yakho yendibano yePCB.Iinjineli zethu kunye neqela lokukhangela banamava atyebileyo kwishishini lokubonelela kunye ne-EMS, kunye nolwazi olunzulu kwindibano ye-SMT evumela ukusombulula yonke imiba yemveliso.Inkonzo yethu ingabizi kakhulu, iguquguquka, kwaye ithembekile.Sanelisa abathengi kuwo onke amashishini amaninzi aquka ezonyango, amashishini, ezemoto kunye nezombane zabathengi.
PCBA Ubunakho
| 1 | Indibano ye-SMT kuquka indibano ye-BGA |
| 2 | Iitshiphusi ze-SMD ezamkelweyo: 0204, BGA, QFP, QFN, TSOP |
| 3 | Ubude becandelo: 0.2-25mm |
| 4 | Ukupakisha ubuncinane: 0204 |
| 5 | Umgama omncinci phakathi kweBGA : 0.25-2.0mm |
| 6 | Ubuncinane BGA ubukhulu: 0.1-0.63mm |
| 7 | Min QFP indawo: 0.35mm |
| 8 | Ubungakanani bendibano encinci: (X * Y): 50 * 30mm |
| 9 | Ubungakanani bendibano enkulu: (X * Y): 350 * 550mm |
| 10 | Ukuchaneka kokubekwa kwindawo: ±0.01mm |
| 11 | Ukukwazi ukubeka: 0805, 0603, 0402 |
| 12 | I-pin count ephezulu ifanelekile |
| 13 | Umthamo we-SMT ngosuku: amanqaku angama-80,000 |
Ukubanakho - SMT
| Imigca | 9(5 Yamaha,4KME) |
| Umthamo | 52 yezigidi zokubekwa ngenyanga |
| Ubungakanani bebhodi yeMax | 457*356mm.(18”X14”) |
| Ubungakanani obuncinci beCandelo | 0201-54 sq.mm.(0.084 sq.inch), isinxibelelanisi eside,CSP,BGA,QFP |
| Isantya | I-0.15 isekhondi / i-chip, i-0.7 imizuzwana / i-QFP |
Ukubanakho - PTH
| Imigca | 2 |
| Ubukhulu bebhodi ububanzi | 400 mm |
| Uhlobo | Amaza amabini |
| Ubume bePbs | Inkxaso yomgca okhokelayo |
| Ubushushu obuphezulu | 399 degree C |
| Ukutshiza okuguquguqukayo | Faka kwi |
| Ukushisa kwangaphambili | 3 |
Ulawulo lwemeko
| Uvavanyo lwe-AOI | Iitshekhi zokujonga i-solder pasteChecks zamacandelo ukuya kuthi ga ku-0201 Ijonga izinto ezingekhoyo, i-offset, iindawo ezingachanekanga, i-polarity |
| Ukuhlolwa kweX-Ray | I-X-Ray ibonelela ngohlolo olukwisisombululo esiphezulu se:BGAs/Micro BGAs/iiphakheji zesikali seChip / iibhodi ezingenanto |
| Uvavanyo lweSekethe | Uvavanyo lwe-In-Circuit Testing ludla ngokusetyenziswa ngokubambisana ne-AOI ukunciphisa iziphene ezibangwa ziingxaki zecandelo. |
| Uvavanyo lwamandla-phezulu | Advanced Function TestFlash Device Programming Uvavanyo olusebenzayo |
- Uhlolo olungenayo lwe-IOC
- SPI solder intlama ukuhlolwa
- Ukuhlolwa kwe-AOI kwi-Intanethi
- Ukuhlolwa kwenqaku lokuqala le-SMT
- Uvavanyo lwangaphandle
- Ukuhlolwa kwe-X-RAY-welding
- BGA isixhobo rework
- Ukuhlolwa kwe-QA
- I-Anti-static warehousing kunye nokuthunyelwa
Isatifikethi
FAQ
Hayi, asikwazi ukwamkela iifayile zemifanekiso, ukuba awunayo ifayile ye-gerber, ungasithumela isampuli ukuyikhuphela.
PCB&PCBA Copy Inkqubo:
Ngexesha lokuhanjiswa kwexesha lingaphezulu kwe-95%
a), iiyure ezingama-24 zijika ngokukhawuleza kwicala eliphindwe kabini leprototype PCB
b),48hours for 4-8 umaleko prototype PCB
c), iyure eyi-1 yocaphulo
d), iiyure ezi-2 zombuzo wenjineli / impendulo yesikhalazo
e), iiyure ze-7-24 zenkxaso yobugcisa / inkonzo ye-odolo / imisebenzi yokuvelisa
I-PCB yibhodi eneengoma zobhedu kunye neepads ezidibanisa izinto zombane.I-PCBA ibhekisa ekudibaneni kwamacandelo kwi-PCB ukwenza isixhobo sombane esisebenzayo.
Sintlama endala isetyenziselwa ukubamba okwethutyana izixhobo ze-elektroniki phambi kokuba zincanyathiselwe ngokusisigxina kwi-PCB ngexesha lenkqubo yokuphinda ithengiselwe.
| Umthamo wemveliso yeemveliso ezithengiswayo ezishushu | |
| Icala eliphindwe kabini/I-Multilayer PCB Workshop | I-Aluminiyam PCB Workshop |
| UbuGcisa boBugcisa | UbuGcisa boBugcisa |
| Imathiriyeli ekrwada: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Izinto ezibonakalayo: Isiseko seAluminiyam, isiseko sobhedu |
| Umaleko: 1 umaleko ukuya kwi-20 Layers | Umaleko: 1 umaleko kunye neeLayers ezi-2 |
| Min.line ububanzi/isithuba: 3mil/3mil(0.075mm/0.075mm) | Min.line ububanzi/isithuba: 4mil/4mil(0.1mm/0.1mm) |
| Ubungakanani bomngxuma omncinci: 0.1mm(umngxuma wokuvala) | Min.Ubungakanani bomngxuma: 12mil(0.3mm) |
| Max.Ubungakanani bebhodi: 1200mm * 600mm | Ubukhulu bebhodi: 1200mm* 560mm(47in* 22in) |
| Ubukhulu bebhodi egqityiweyo: 0.2mm- 6.0mm | Ugqitywe ubukhulu bebhodi: 0.3 ~ 5mm |
| Ubukhulu befoyile yobhedu: 18um~280um(0.5oz~8oz) | Ubukhulu befoyile yobhedu: 35um~210um(1oz~6oz) |
| NPTH Ukunyamezela umngxuma: +/-0.075mm, PTH ukunyamezela umngxuma: +/-0.05mm | Ukunyamezela indawo yomngxuma: +/-0.05mm |
| Ukunyamezelana kolwandlalo: +/-0.13mm | Ukunyamezela ulwandlalo lwendlela: +/ 0.15mm;ukunyamezela ulwandlalo lokubetha:+/ 0.1mm |
| Umphezulu ugqityiwe: I-HASL engenalo isikhokelo, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP, ukufakwa kwegolide, umnwe wegolide, iCarbon INK. | Umphezulu ugqityiwe: Isikhokelo sasimahla seHASL, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP njl |
| Ukunyamezela ukunyamezela: +/-10% | Hlala ukunyamezela ubunzima: +/-0.1mm |
| Ikhono lokuvelisa: 50,000 sqm / ngenyanga | MC PCB Ukuvelisa amandla: 10,000 sqm / ngenyanga |
Iinkqubo zethu zokuqinisekisa uMgangatho njengalapha ngezantsi:
a), uHlolo oluBonakalayo
b),I-Flying probe, isixhobo sokulungisa
c), Ulawulo lwe-impedance
d), ukubonwa kobuchule beSolder
e), Imakroskopu yeDijithali ye-metallog
f),AOI(Uhlolo oluzenzekelayo lwe-Optical)
Ibhili yezixhobo (BOM) echaza:
a),MAmanani amalungu e-nufacturers,
b),Cinombolo yamalungu abaxhasi (umzekelo, iqhosha leDigi, iMouse, RS)
c), iifoto zesampula zePCBA ukuba kunokwenzeka.
d), Ubungakanani
I-ABIS ayinayo iimfuno ze-MOQ nokuba ze-PCB okanye i-PCBA.
| Umthamo wemveliso yeemveliso ezithengiswayo ezishushu | |
| Icala eliphindwe kabini/I-Multilayer PCB Workshop | I-Aluminiyam PCB Workshop |
| UbuGcisa boBugcisa | UbuGcisa boBugcisa |
| Imathiriyeli ekrwada: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Izinto ezibonakalayo: Isiseko seAluminiyam, isiseko sobhedu |
| Umaleko: 1 umaleko ukuya kwi-20 Layers | Umaleko: 1 umaleko kunye neeLayers ezi-2 |
| Min.line ububanzi/isithuba: 3mil/3mil(0.075mm/0.075mm) | Min.line ububanzi/isithuba: 4mil/4mil(0.1mm/0.1mm) |
| Ubungakanani bomngxuma omncinci: 0.1mm(umngxuma wokuvala) | Min.Ubungakanani bomngxuma: 12mil(0.3mm) |
| Max.Ubungakanani bebhodi: 1200mm * 600mm | Ubukhulu bebhodi: 1200mm* 560mm(47in* 22in) |
| Ubukhulu bebhodi egqityiweyo: 0.2mm- 6.0mm | Ugqitywe ubukhulu bebhodi: 0.3 ~ 5mm |
| Ubukhulu befoyile yobhedu: 18um~280um(0.5oz~8oz) | Ubukhulu befoyile yobhedu: 35um~210um(1oz~6oz) |
| NPTH Ukunyamezela umngxuma: +/-0.075mm, PTH ukunyamezela umngxuma: +/-0.05mm | Ukunyamezela indawo yomngxuma: +/-0.05mm |
| Ukunyamezelana kolwandlalo: +/-0.13mm | Ukunyamezela ulwandlalo lwendlela: +/ 0.15mm;ukunyamezela ulwandlalo lokubetha:+/ 0.1mm |
| Umphezulu ugqityiwe: I-HASL engenalo isikhokelo, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP, ukufakwa kwegolide, umnwe wegolide, iCarbon INK. | Umphezulu ugqityiwe: Isikhokelo sasimahla seHASL, igolide yokuntywiliselwa (ENIG), isilivere yokuntywiliselwa, i-OSP njl |
| Ukunyamezela ukunyamezela: +/-10% | Hlala ukunyamezela ubunzima: +/-0.1mm |
| Ikhono lokuvelisa: 50,000 sqm / ngenyanga | MC PCB Ukuvelisa amandla: 10,000 sqm / ngenyanga |
·Nge-ABIS, abathengi banciphisa ngokubonakalayo nangempumelelo iindleko zabo zokuthenga kwihlabathi.Emva kwenkonzo nganye ebonelelwa yi-ABIS, kufihlwe ukonga iindleko kubathengi.
.Sineevenkile ezimbini kunye, enye yeyeprototype, ukujika ngokukhawuleza, kunye nokwenza umthamo omncinci.Enye yeyokuvelisa ngobuninzi kunye nebhodi ye-HDI, enabasebenzi abanobuchule obuphezulu, kwiimveliso ezikumgangatho ophezulu kunye namaxabiso akhuphisanayo kunye nokuhanjiswa kwexesha.
.Sibonelela ngeentengiso zobungcali kakhulu, inkxaso yobugcisa kunye nenkqubo, kwihlabathi jikelele ngeeyure ezingama-24 zengxelo yesikhalazo.
