Iintlobo ezahlukeneyo zokupakishwa kwee-SMDs

Ngokwendlela yokuhlanganisa, amacandelo e-elektroniki anokwahlulwa abe ngamacandelo omngxuma-mngxunya kunye nezixhobo ze-surface Mount (SMC).Kodwa kwishishini,IziXhobo zokuHlaba umphezulu (SMDs) isetyenziswa ngakumbi ukuchaza oku umphezuluicandelo ezizi isetyenziswe kwi-electronics efakwe ngokuthe ngqo kumphezulu webhodi yesekethe eprintiweyo (PCB).Ii-SMD ziza ngeendlela ezahlukeneyo zokupakisha, nganye iyilelwe iinjongo ezithile, imiqobo yendawo, kunye neemfuno zokuvelisa.Nazi ezinye iintlobo eziqhelekileyo zokupakishwa kwe-SMD:

1. Iiphakheji ze-SMD Chip (Rectangular):

I-SOIC (I-Small Outline Integrated Circuit): Iphakheji yoxande ene-gull-wing ikhokelela kumacala amabini, afanelekileyo kwiisekethe ezidibeneyo.

I-SSO (Nciphisa iPhakethi yeSishwankathelo esiNcinci): Iyafana ne-SOIC kodwa inobungakanani bomzimba omncinci kunye nesandi esicolekileyo.

I-TSSOP (I-Thin Shrink Small Outline Package): Inguqulelo encinci ye-SSO.

I-QFP (i-Quad Flat Package): Iphakheji yesikwere okanye i-rectangular enezikhokelo kuwo onke macala amane.Inokuba yiprofayili ephantsi (LQFP) okanye i-fine-pitch (VQFP).

I-LGA (i-Land Grid Array): Akukho zikhokelo;endaweni yoko, iipads zoqhagamshelwano zicwangciswe kwigridi kumphezulu ongezantsi.

2. Iiphakheji ze-SMD Chip (isikwere):

I-CSP (i-Chip Scale Package): I-compact kakhulu kunye neebhola ze-solder ngokuthe ngqo kwimiphetho yecandelo.Yenzelwe ukuba isondele kubungakanani beyona chip.

I-BGA (i-Ball Grid Array): Iibhola ze-Solder ezicwangciswe kwigridi phantsi kwepakethi, zibonelela ngokusebenza kakuhle kwe-thermal kunye nombane.

I-FBGA (I-Fine-Pitch BGA): Iyafana ne-BGA kodwa ine-pitch ecolekileyo yoxinaniso lwecandelo eliphezulu.

3. I-SMD Diode kunye ne-Transistor Packages:

I-SOT (i-Small Outline Transistor): Iphakheji encinci ye-diode, i-transistors, kunye nezinye izinto ezincinci ezicacileyo.

I-SOD (I-Outline Diode encinci): Ifana ne-SOT kodwa ngokukodwa kwiidiode.

YENZA (Ulwandlalo lweDiode):  Iiphakheji ezincinci ezahlukeneyo zediode kunye nezinye izinto ezincinci.

4.I-SMD ye-Capacitor kunye ne-Resistor Packages:

0201, 0402, 0603, 0805, njl.: Ezi ziikhowudi zamanani ezimele imilinganiselo yecandelo kwisishumi seemilimitha.Umzekelo, i-0603 ibonisa icandelo elilinganisa i-0.06 x 0.03 intshi (1.6 x 0.8 mm).

5. Ezinye iiPakethi ze-SMD:

I-PLCC (I-Plastic Leaded Chip Carrier): Iphakheji yesikwere okanye i-rectangular enezikhokelo kuwo onke macala amane, afanelekile kwii-ICs kunye namanye amacandelo.

TO252, TO263, njl.: Ezi ziinguqulelo ze-SMD zeepakethe zecandelo lomngxunya eziqhelekileyo ezifana ne-TO-220, TO-263, ezinomzantsi osicaba wokunyuswa komphezulu.

Nganye kwezi ntlobo zepakethe zineenzuzo kunye nezingeloncedo ngokubhekiselele kubukhulu, ukukhululeka kokudibanisa, ukusebenza kwe-thermal, iimpawu zombane, kunye neendleko.Ukukhetha iphakheji ye-SMD kuxhomekeke kwizinto ezifana nomsebenzi wecandelo, indawo yebhodi ekhoyo, amandla okuvelisa, kunye neemfuno zokushisa.